产品系列

罗斌森
  • TLV274CDR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 4
    Output Type : Rail-to-Rail
    Slew Rate : 2.6V/μs
    Gain Bandwidth Product : 3MHz
    Current - Input Bias : 1pA
    Voltage - Input Offset : 500μV
    Current - Supply : 625μA
    Current - Output / Channel : 8mA
    Voltage - Supply, Single/Dual (±) : 2.7V ~ 16V, ±1.35V ~ 8V
    Operating Temperature : 0°C ~ 70°C
    Mounting Type : Surface Mount
    Package / Case : 14-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 14-SOIC

极速报价

型号
品牌 封装 批号 查看
ADS8471IRGZR TI 48-VQFN (7x7) New 详细
SN74ABT821ANSRG4 TI New 详细
ADS122U04EVM TI New 详细
74ACT16841DL TI 56-SSOP New 详细
ADS5424IPGP TI 52-HTQFP (10x10) New 详细
TLV2475IPWPR TI 16-HTSSOP New 详细
TPS54339DDAR TI 8-SO PowerPad New 详细
LM317AT/NOPB TI TO-220-3 New 详细
BQ24450DW TI 16-SOIC New 详细
LM2707MFX/NOPB TI SOT-23-8 New 详细
TPS61201EVM-179 TI New 详细
SN74LVC3G17DCURG4 TI US8 New 详细
SN74LV374ATPWREP TI New 详细
REG103FA-2.7 TI DDPAK/TO-263-5 New 详细
SN65HVD78DRBR TI 8-SON (3x3) New 详细
TL16C2752FN TI 44-PLCC (16.58x16.58) New 详细
LMH6739MQ TI 16-SSOP New 详细
TLV73325PQDRVRQ1 TI 6-WSON (2x2) New 详细
SM320VC5507PGESEP TI 144-LQFP (20x20) New 详细
TPA2011D1YFFR TI 9-DSBGA (1.2x1.3) New 详细