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罗斌森
  • TLV2773CDGS

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 2
    Output Type : Rail-to-Rail
    Slew Rate : 10.5V/μs
    Gain Bandwidth Product : 5.1MHz
    Current - Input Bias : 2pA
    Voltage - Input Offset : 700μV
    Current - Supply : 1mA
    Current - Output / Channel : 50mA
    Voltage - Supply, Single/Dual (±) : 2.5V ~ 5.5V, ±1.25V ~ 2.75V
    Operating Temperature : 0°C ~ 70°C
    Mounting Type : Surface Mount
    Package / Case : 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
    Supplier Device Package : 10-VSSOP

极速报价

型号
品牌 封装 批号 查看
MSP430F5171IYFFT TI 40-DSBGA New 详细
LM3671MF-ADJ/NOPB TI SOT-23-5 New 详细
SN74AUP1T98DBVT TI SOT-23-6 New 详细
LM4051BIM3X-ADJ/NOPB TI SOT-23-3 New 详细
TMDXEVM388 TI New 详细
SN74AHC125QDR TI 14-SOIC New 详细
SN74LS595NSRE4 TI 16-SO New 详细
THS4271MDGNREP TI 8-MSOP-PowerPad New 详细
O917A152TRGZRQ1 TI 48-VFQFN (7x7) New 详细
AFE5818ZBV TI 289-NFBGA (15x15) New 详细
LP2985-25DBVR TI SOT-23-5 New 详细
OPA836IRUNT TI 10-QFN (2x2) New 详细
HD3SS215ZQER TI 50-BGA MicroStar Jr. (5x5) New 详细
SN74HC573APWR TI 20-TSSOP New 详细
SN74ABT540DWR TI 20-SOIC New 详细
TLE2061AIP TI 8-PDIP New 详细
BQ27621YZFT-G1A TI 9-DSBGA New 详细
TPS78223DDCR TI SOT-23-5 New 详细
LMS1585ACS-3.3 TI DDPAK/TO-263-3 New 详细
LP3874ESX-1.8 TI DDPAK/TO-263-5 New 详细