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罗斌森
  • TLC2274ACDR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : LinCMOS?
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 4
    Output Type : Rail-to-Rail
    Slew Rate : 3.6V/μs
    Gain Bandwidth Product : 2.25MHz
    Current - Input Bias : 1pA
    Voltage - Input Offset : 300μV
    Current - Supply : 4.8mA
    Current - Output / Channel : 50mA
    Voltage - Supply, Single/Dual (±) : 4.4V ~ 16V, ±2.2V ~ 8V
    Operating Temperature : 0°C ~ 70°C
    Mounting Type : Surface Mount
    Package / Case : 14-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 14-SOIC

极速报价

型号
品牌 封装 批号 查看
REG102NA-2.8/250 TI SOT-23-5 New 详细
ADS6223IRGZT TI 48-VQFN (7x7) New 详细
74AHCT1G125DBVTG4 TI SOT-23-5 New 详细
LM2852XMXA-0.8/NOPB TI 14-HTSSOP New 详细
CD4018BPWR TI 16-TSSOP New 详细
DRV421RTJT TI 20-QFN (4x4) New 详细
TL4050C50IDCKR TI SC-70-5 New 详细
SN75LVDS179DR TI 8-SOIC New 详细
TPS79928DDCT TI SOT-23-5 New 详细
LM2598SX-3.3/NOPB TI DDPAK/TO-263-7 New 详细
LM335Z TI TO-92-3 New 详细
MSP430F5132IRSBR TI 40-WQFN (5x5) New 详细
TPS3850G30DRCR TI 10-VSON (3x3) New 详细
TPA3107D2EVM TI New 详细
TPS92515HVDGQT TI 10-MSOP-PowerPad New 详细
SN74HC00PWT TI 14-TSSOP New 详细
INA2133U/2K5 TI 14-SOIC New 详细
TPA2016D2RTJT TI 20-QFN (4x4) New 详细
LM2677SX-3.3 TI DDPAK/TO-263-7 New 详细
TPS2483EVM-157 TI New 详细