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罗斌森
  • TLC2274CDR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : LinCMOS?
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 4
    Output Type : Rail-to-Rail
    Slew Rate : 3.6V/μs
    Gain Bandwidth Product : 2.25MHz
    Current - Input Bias : 1pA
    Voltage - Input Offset : 300μV
    Current - Supply : 4.8mA
    Current - Output / Channel : 50mA
    Voltage - Supply, Single/Dual (±) : 4.4V ~ 16V, ±2.2V ~ 8V
    Operating Temperature : 0°C ~ 70°C
    Mounting Type : Surface Mount
    Package / Case : 14-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 14-SOIC

极速报价

型号
品牌 封装 批号 查看
SN74LV244ATDGVRE4 TI 20-TVSOP New 详细
LM3477MMX/NOPB TI 8-VSSOP New 详细
EKT-LM3S9B92 TI New 详细
SN65LVDM176DR TI 8-SOIC New 详细
LP3941LQX-A TI 48-LLP New 详细
TPS7301QPWR TI 20-TSSOP New 详细
TPS71733QDRVRQ1 TI 6-SON (2x2) New 详细
CY74FCT2652CTQCT TI 24-SSOP/QSOP New 详细
LMX2531LQ2220E/NOPB TI 36-WQFN (6x6) New 详细
LM5116MHX/NOPB TI 20-HTSSOP New 详细
PGA900ARHHR TI 36-VQFN (6x6) New 详细
SN65LBC175D TI 16-SOIC New 详细
SN74CBTS6800DBQR TI 24-SSOP/QSOP New 详细
SN74LV06APW TI 14-TSSOP New 详细
DS9637ACMX TI New 详细
SN74AHCT04RGYR TI 14-VQFN (3.5x3.5) New 详细
OPA340NA/3K TI SOT-23-5 New 详细
TPD1E05U06-Q1EVM TI New 详细
LDC2112YFDT TI 16-DSBGA New 详细
LP3855ES-1.8/NOPB TI DDPAK/TO-263-5 New 详细