产品系列

罗斌森
  • TLC2274MDREP

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : LinCMOS?
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 4
    Output Type : Rail-to-Rail
    Slew Rate : 3.6V/μs
    Gain Bandwidth Product : 2.25MHz
    Current - Input Bias : 1pA
    Voltage - Input Offset : 300μV
    Current - Supply : 4.8mA
    Current - Output / Channel : 50mA
    Voltage - Supply, Single/Dual (±) : 4.4V ~ 16V, ±2.2V ~ 8V
    Operating Temperature : -55°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 14-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 14-SOIC

极速报价

型号
品牌 封装 批号 查看
SN74ABT244APW TI 20-TSSOP New 详细
BQ24195LEVM-193 TI New 详细
SN74ALS1034D TI 14-SOIC New 详细
TPS77501PWP TI 20-HTSSOP New 详细
LM3S1D21-IQC80-A2T TI 100-LQFP (14x14) New 详细
TPS77515MPWPREP TI 20-HTSSOP New 详细
TLV5604CPW TI 16-TSSOP New 详细
ADC121S051CIMFX TI SOT-23-6 New 详细
BQ29702DSET TI 6-WSON (1.5x1.5) New 详细
TRS3232CDG4 TI 16-SOIC New 详细
TPS62044DGQ TI 10-MSOP-PowerPad New 详细
THS4304DBVT TI SOT-23-5 New 详细
TPS793285QDBVRQ1 TI SOT-23-5 New 详细
LM4040EIZ-2.0/NOPB TI TO-92-3 New 详细
SN74LVC1G07YZVR TI 4-DSBGA (0.88x0.88) New 详细
TPS79118DBVRQ1 TI SOT-23-5 New 详细
CDCLVP2102RGTT TI 16-QFN (3x3) New 详细
TPS62826DMQT TI New 详细
LM2585S-12 TI DDPAK/TO-263-5 New 详细
BQ25100BYFPR TI 6-DSBGA New 详细