罗斌森
  • TLC3702MD

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Series : LinCMOS?
    Part Status : Active
    Type : General Purpose
    Number of Elements : 2
    Output Type : CMOS, Push-Pull, TTL
    Voltage - Supply, Single/Dual (±) : 4V ~ 16V
    Voltage - Input Offset (Max) : 5mV @ 10V
    Current - Input Bias (Max) : 5pA @ 5V
    Current - Output (Typ) : 20mA
    Current - Quiescent (Max) : 90μA
    CMRR, PSRR (Typ) : 84dB CMRR
    Propagation Delay (Max) : 4.5μs
    Operating Temperature : -55°C ~ 125°C
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Mounting Type : Surface Mount
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
UCC3882PWTR-1G4 TI 28-TSSOP New 详细
74FCT2374CTSOCTE4 TI New 详细
SN74LVT32240GKER TI 96-LFBGA (13.5x5.5) New 详细
LP5996SDX-3333 TI 10-SON (3x3) New 详细
UCC38085PWG4 TI 8-TSSOP New 详细
74AC11240NTG4 TI 24-PDIP New 详细
TPS22969DNYR TI 8-WSON (3x3) New 详细
MSP430F5258IRGCR TI 64-VQFN (9x9) New 详细
LP2989AIMMX-3.3/NOPB TI 8-VSSOP New 详细
BQ27505YZGR-J5 TI 12-DSBGA New 详细
SN74ALS240A-1DWRE4 TI 20-SOIC New 详细
TPS71733DCKT TI SC-70-5 New 详细
LMP8480ASQDGKRQ1 TI 8-VSSOP New 详细
SN74LVT240ADGVR TI 20-TVSOP New 详细
LMV821IDCKRE4 TI SC-70-5 New 详细
TPS62130ARGTR TI 16-QFN (3x3) New 详细
DS2003CMX TI 16-SOIC New 详细
SN74LVC2G06YZAR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细
TMS320DM642GDK600 TI 548-FC/CSP (23x23) New 详细
SN74LV373ATDWG4 TI 20-SOIC New 详细