产品系列
产品系列
TLC3702MDR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : LinCMOS?
Part Status : Active
Type : General Purpose
Number of Elements : 2
Output Type : CMOS, Push-Pull, TTL
Voltage - Supply, Single/Dual (±) : 4V ~ 16V
Voltage - Input Offset (Max) : 5mV @ 10V
Current - Input Bias (Max) : 5pA @ 5V
Current - Output (Typ) : 20mA
Current - Quiescent (Max) : 90μA
CMRR, PSRR (Typ) : 84dB CMRR
Propagation Delay (Max) : 4.5μs
Operating Temperature : -55°C ~ 125°C
Package / Case : 8-SOIC (0.154", 3.90mm Width)
Mounting Type : Surface Mount
Supplier Device Package : 8-SOIC
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74LVC541AQDWREP | TI | 20-SOIC | New | 详细 | |
| OMAPL138EZCE3 | TI | 361-NFBGA (13x13) | New | 详细 | |
| TPS62091RGTT | TI | 16-QFN (3x3) | New | 详细 | |
| LM3S8738-EQC50-A2 | TI | 100-LQFP (14x14) | New | 详细 | |
| MSP430F2417TPMR | TI | 64-LQFP (10x10) | New | 详细 | |
| TS3USBA225RUTR | TI | 12-UQFN (1.7x2) | New | 详细 | |
| DS3696AMX | TI | 8-SOIC | New | 详细 | |
| DS91D176TMAX | TI | New | 详细 | ||
| LP3876ES-5.0/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| ULQ2003ADG4 | TI | 16-SOIC | New | 详细 | |
| ADS6423IRGC25 | TI | 64-VQFN (9x9) | New | 详细 | |
| ADS5547EVM | TI | New | 详细 | ||
| TPS2210APWPR | TI | 24-HTSSOP | New | 详细 | |
| MSP430F6723IPN | TI | 80-LQFP (12x12) | New | 详细 | |
| TPA2035D1YZFR | TI | 9-DSBGA | New | 详细 | |
| INA214CQDCKRQ1 | TI | SC-70-6 | New | 详细 | |
| SN7400N | TI | 14-PDIP | New | 详细 | |
| SN75186DWRE4 | TI | 24-SOIC | New | 详细 | |
| TLV7101828DSER | TI | 6-WSON (1.5x1.5) | New | 详细 | |
| LM3S1968-EQC50-A2 | TI | 100-LQFP (14x14) | New | 详细 |
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