产品系列

罗斌森
  • SN74TVC3306DCUR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Logic Type : Voltage Clamp
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 8-VFSOP (0.091", 2.30mm Width)
    Supplier Device Package : US8

极速报价

型号
品牌 封装 批号 查看
TPS56628EVM-534 TI New 详细
SN74LVC374ANSR TI New 详细
LP38843SX-0.8 TI DDPAK/TO-263-5 New 详细
UCC3580N-1G4 TI 16-PDIP New 详细
CD74HC4511M TI 16-SOIC New 详细
SN74ALVCHR16245KR TI 56-BGA MICROSTAR JUNIOR (7.0x4.5) New 详细
TLC59213IPWR TI 20-TSSOP New 详细
TSC2020IRTVR TI 32-WQFN (5x5) New 详细
LMH6643MM/NOPB TI 8-VSSOP New 详细
LM12458CIV TI 44-PLCC (16.58x16.58) New 详细
LM4040D20ILP TI TO-92-3 New 详细
UC2714DP TI 16-SOIC New 详细
CC2640F128RGZT TI 48-VQFN (7x7) New 详细
LDC1000QEVM TI New 详细
BQ2012SN-D107G4 TI 16-SOIC New 详细
LM2941LD/NOPB TI 8-WSON (4x4) New 详细
ADS6424IRGC25 TI 64-VQFN (9x9) New 详细
SN74AHC14NSR TI 14-SOP New 详细
CC1310F32RGZR TI New 详细
LM4846TLX/NOPB TI 25-uSMD New 详细