产品系列
SN74TVC3306DCUR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Part Status : Active
Logic Type : Voltage Clamp
Operating Temperature : -40°C ~ 85°C
Mounting Type : Surface Mount
Package / Case : 8-VFSOP (0.091", 2.30mm Width)
Supplier Device Package : US8
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM3S1608-IBZ50-A2T | TI | 108-BGA (10x10) | New | 详细 | |
| LM4132AMFX-3.0 | TI | SOT-23-5 | New | 详细 | |
| LM3S5U91-IBZ80-A1 | TI | 108-BGA (10x10) | New | 详细 | |
| SN75121NSR | TI | 16-SO | New | 详细 | |
| LM3S1968-IBZ50-A2 | TI | 108-BGA (10x10) | New | 详细 | |
| DS90C031TM/NOPB | TI | 16-SOIC | New | 详细 | |
| LP2996AMR/NOPB | TI | 8-SO PowerPad | New | 详细 | |
| SN74LVC74AMDREP | TI | New | 详细 | ||
| TPS2490DGSR | TI | 10-VSSOP | New | 详细 | |
| THS1030IDWRG4 | TI | 28-SOIC | New | 详细 | |
| SN74CBTD16211DL | TI | 56-SSOP | New | 详细 | |
| CSD97376Q4M | TI | 8-VSON (3.5x4.5) | New | 详细 | |
| SN74ALS569ADW | TI | 20-SOIC | New | 详细 | |
| LP3964ESX-2.5 | TI | DDPAK/TO-263-5 | New | 详细 | |
| TPA3100D2RGZR | TI | 48-VQFN (7x7) | New | 详细 | |
| OPA552FAKTWT | TI | DDPAK/TO-263-7 | New | 详细 | |
| CY74FCT2244ATQCT | TI | 20-SSOP/QSOP | New | 详细 | |
| TPS76850QPWPREP | TI | 20-HTSSOP | New | 详细 | |
| LMH1981MTEVAL/NOPB | TI | New | 详细 | ||
| TPS79650DRBT | TI | 8-SON (3x3) | New | 详细 |
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