产品系列
产品系列
TLV2374MDREP
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Part Status : Active
Amplifier Type : General Purpose
Number of Circuits : 4
Output Type : Rail-to-Rail
Slew Rate : 2.1V/μs
Gain Bandwidth Product : 3MHz
Current - Input Bias : 1pA
Voltage - Input Offset : 2mV
Current - Supply : 750μA
Voltage - Supply, Single/Dual (±) : 2.7V ~ 16V, ±1.35V ~ 8V
Operating Temperature : -55°C ~ 125°C
Mounting Type : Surface Mount
Package / Case : 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package : 14-SOIC
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LP3965ESX-ADJ/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| DRV8880PWPR | TI | 28-HTSSOP | New | 详细 | |
| SN74S08NSR | TI | 14-SOP | New | 详细 | |
| TRSF23243CDLR | TI | 48-SSOP | New | 详细 | |
| LM4132BMF-1.8/NOPB | TI | SOT-23-5 | New | 详细 | |
| CD4086BM96 | TI | 14-SOIC | New | 详细 | |
| LM3S5P31-IBZ80-C1 | TI | 108-BGA (10x10) | New | 详细 | |
| BQ29311PWRG4 | TI | 24-TSSOP | New | 详细 | |
| 74AC16244DLR | TI | 48-SSOP | New | 详细 | |
| TPA3008D2PHP | TI | 48-HTQFP (7x7) | New | 详细 | |
| TPS82675EVM-646 | TI | New | 详细 | ||
| LM3S808-IGZ50-C2T | TI | 48-VQFN (7x7) | New | 详细 | |
| TS5A23166YZPR | TI | 8-DSBGA, 8-WCSP (1.9x0.9) | New | 详细 | |
| LMH6551MM | TI | 8-VSSOP | New | 详细 | |
| DAC715PK | TI | 28-PDIP | New | 详细 | |
| AM3715CBPA | TI | 515-POP-FCBGA (12x12) | New | 详细 | |
| TPS55010EVM-009 | TI | New | 详细 | ||
| SN74CB3T3253DBQR | TI | 16-SSOP | New | 详细 | |
| TLV62150ARGTR | TI | New | 详细 | ||
| TLV320AIC3100IRHBT | TI | 32-VQFN (5x5) | New | 详细 |
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