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罗斌森
  • TLV2470CDR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 1
    Output Type : Rail-to-Rail
    Slew Rate : 1.5V/μs
    Gain Bandwidth Product : 2.8MHz
    Current - Input Bias : 2.5pA
    Voltage - Input Offset : 250μV
    Current - Supply : 600μA
    Current - Output / Channel : 35mA
    Voltage - Supply, Single/Dual (±) : 2.7V ~ 6V, ±1.35V ~ 3V
    Operating Temperature : 0°C ~ 70°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
LP2985AITPX-2.8/NOPB TI 5-DSBGA New 详细
LP3985IBL-2.5 TI 5-DSBGA (1.41x1.08) New 详细
LM117K TI TO-3-2 New 详细
DLP9000BFLS TI 355-CLGA (42.2x42.2) New 详细
TL4051CQDCKT TI SC-70-5 New 详细
THS3062DDAR TI 8-SO PowerPad New 详细
DRV8873S-Q1EVM TI New 详细
OPA2694IDRG4 TI 8-SOIC New 详细
LME49860MA/NOPB TI 8-SOIC New 详细
TLC3544IDW TI 20-SOIC New 详细
LM7332MM/NOPB TI 8-VSSOP New 详细
LP3923TL/NOPB TI 30-TuSMD New 详细
LM150K STEEL/NOPB TI TO-3-2 New 详细
OPA2354AIDDA TI 8-SO PowerPad New 详细
LM3S5747-IQC50-A0 TI 100-LQFP (14x14) New 详细
LP8340CLD-2.5/NOPB TI 6-WSON (2.92x3.29) New 详细
LMR23615DRRT TI 12-SON (3x3) New 详细
THS4011CD TI 8-SOIC New 详细
TL16C450FNR TI 44-PLCC (16.58x16.58) New 详细
TPA3123D2EVM TI New 详细