产品系列
TLV5637ID
- Manufacturer : Texas Instruments
Packaging : Tube
Alternate Packaging
Part Status : Active
Number of Bits : 10
Number of D/A Converters : 2
Settling Time : 5.5μs
Output Type : Voltage - Buffered
Differential Output : No
Data Interface : SPI
Reference Type : External, Internal
Voltage - Supply, Analog : 2.7V ~ 3.3V, 5V
Voltage - Supply, Digital : 2.7V ~ 3.3V, 5V
INL/DNL (LSB) : ±0.4, ±0.1
Architecture : String DAC
Operating Temperature : -40°C ~ 85°C
Package / Case : 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package : 8-SOIC
Mounting Type : Surface Mount
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM317KTTR | TI | DDPAK/TO-263-3 | New | 详细 | |
| TPS65300QRHFRQ1 | TI | 24-VQFN (5x4) | New | 详细 | |
| LM48310SDX/NOPB | TI | 10-WSON (3x3) | New | 详细 | |
| BQ29400DCT3 | TI | SM8 (SSOP) | New | 详细 | |
| ADS8402IPFBRG4 | TI | 48-TQFP (7x7) | New | 详细 | |
| SN74HCT139DR | TI | 16-SOIC | New | 详细 | |
| DS90C383BMT/NOPB | TI | 56-TSSOP | New | 详细 | |
| LM3279EVM | TI | New | 详细 | ||
| CY74FCT377CTSOCG4 | TI | New | 详细 | ||
| SN74LV21APWTE4 | TI | 14-TSSOP | New | 详细 | |
| TPS65563ARGTR | TI | 16-QFN (3x3) | New | 详细 | |
| MSP430F2254IRHAR | TI | 40-VQFN (6x6) | New | 详细 | |
| LP3855ET-2.5 | TI | TO-220-5 | New | 详细 | |
| TLV2170IDGKR | TI | 8-VSSOP | New | 详细 | |
| AM5726BABCX | TI | 760-FCBGA (23x23) | New | 详细 | |
| LM2931SX-5.0 | TI | DDPAK/TO-263-3 | New | 详细 | |
| LMH6321TS/NOPB | TI | DDPAK/TO-263-7 | New | 详细 | |
| SN74LV245ATNS | TI | 20-SO | New | 详细 | |
| TPS76933DBVR | TI | SOT-23-5 | New | 详细 | |
| TPS40070PWPR | TI | 16-HTSSOP | New | 详细 |
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