产品系列
产品系列
TLV6002IDR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Part Status : Active
Amplifier Type : General Purpose
Number of Circuits : 2
Output Type : Rail-to-Rail
Slew Rate : 0.5V/μs
Gain Bandwidth Product : 1MHz
-3db Bandwidth : 1MHz
Current - Input Bias : 1pA
Voltage - Input Offset : 750μV
Current - Supply : 75μA
Voltage - Supply, Single/Dual (±) : 1.8V ~ 5.5V, ±0.9V ~ 2.75V
Operating Temperature : -40°C ~ 125°C
Mounting Type : Surface Mount
Package / Case : 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package : 8-SOIC
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74LS157DR | TI | 16-SOIC | New | 详细 | |
| TPS79912DRVT | TI | 6-SON (2x2) | New | 详细 | |
| MSP430F2132QRHBREP | TI | New | 详细 | ||
| TPS74901RGWT | TI | 20-VQFN (5x5) | New | 详细 | |
| TL4051AQDBZT | TI | SOT-23-3 | New | 详细 | |
| SN74LV374ATNS | TI | New | 详细 | ||
| LMC6482AIM/NOPB | TI | 8-SOIC | New | 详细 | |
| LM4120AIM5X-2.5 | TI | SOT-23-5 | New | 详细 | |
| AUDK2G | TI | New | 详细 | ||
| CDC586PAHRG4 | TI | 52-TQFP (10x10) | New | 详细 | |
| LM2587SX-3.3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| DAC8831ICRGYRG4 | TI | 14-VQFN (3.5x3.5) | New | 详细 | |
| UCC5614PWPG4 | TI | 24-HTSSOP | New | 详细 | |
| 74GTLP2033DGVRE4 | TI | 48-TVSOP | New | 详细 | |
| SN74ALVTH16821GR | TI | New | 详细 | ||
| LMV7272TLX/NOPB | TI | 8-uSMD | New | 详细 | |
| TMS32C6414DGLZ5E0 | TI | 532-FCBGA (23x23) | New | 详细 | |
| ADC10DV200EB/NOPB | TI | New | 详细 | ||
| TLV320DAC23IGQE | TI | 80-BGA MICROSTAR JUNIOR (5x5) | New | 详细 | |
| TPA0202PWP | TI | 24-HTSSOP | New | 详细 |
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