罗斌森
  • TLV7011DPWR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Number of Elements : 1
    Output Type : Push-Pull
    Voltage - Supply, Single/Dual (±) : 1.6V ~ 5.5V
    Voltage - Input Offset (Max) : 8mV
    Current - Input Bias (Max) : 1pA
    Current - Quiescent (Max) : 5μA
    CMRR, PSRR (Typ) : 78dB CMRR, 78dB PSRR
    Propagation Delay (Max) : 350ns
    Hysteresis : 4.2mV
    Operating Temperature : -40°C ~ 125°C
    Package / Case : 5-XFDFN Exposed Pad
    Mounting Type : Surface Mount
    Supplier Device Package : 5-X2SON (0.80x0.80)

极速报价

型号
品牌 封装 批号 查看
TPS62354YZGR TI 12-DSBGA New 详细
LMV232TLX/NOPB TI 8-DSBGA (1.56x1.56) New 详细
DAC8831IBRGYR TI 14-VQFN (3.5x3.5) New 详细
TPS715A01DRBR TI 8-SON (3x3) New 详细
TM4C123GH6ZRBI7 TI 157-BGA MicroStar Jr (9x9) New 详细
LM5015MH/NOPB TI 14-HTSSOP New 详细
SN74HCT645PWT TI 20-TSSOP New 详细
ADC121C021CIMK/NOPB TI TSOT-23-6 New 详细
LM4128AMF-2.5/NOPB TI SOT-23-5 New 详细
VSP2212Y/2K TI 48-LQFP (7x7) New 详细
TPS2811QPWRQ1 TI 8-TSSOP New 详细
SN74LVC2G00DCTR TI SM8 (SSOP) New 详细
TPS70625DBVR TI SOT-23-5 New 详细
LM4040BIM3-4.1 TI SOT-23-3 New 详细
UC2842AD8 TI 8-SOIC New 详细
TPS62616YFDT TI 6-DSBGA (1.30x.93) New 详细
SN74AHC14QDRG4Q1 TI 14-SOIC New 详细
TMS320DM643AGDK5 TI 548-FC/CSP (23x23) New 详细
LMX2326SLBX/NOPB TI 16-CSP (3.5x3.5) New 详细
LM2598S-ADJ/NOPB TI DDPAK/TO-263-7 New 详细