产品系列

罗斌森
  • TMS370C732AFNT

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Series : TMS370
    Part Status : Obsolete
    Core Processor : TMS370
    Core Size : 8-Bit
    Speed : 5MHz
    Connectivity : SCI, SPI
    Peripherals : PWM, WDT
    Number of I/O : 23
    Program Memory Size : 8KB (8K x 8)
    Program Memory Type : OTP
    EEPROM Size : 256 x 8
    RAM Size : 256 x 8
    Voltage - Supply (Vcc/Vdd) : 4.5V ~ 5.5V
    Data Converters : A/D 8x8b
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 44-LCC (J-Lead)
    Supplier Device Package : 44-PLCC (16.58x16.58)

极速报价

型号
品牌 封装 批号 查看
OPA4234U/2K5 TI 14-SOIC New 详细
LM3S1751-IQC50-A2T TI 100-LQFP (14x14) New 详细
SN74LVTH16240DGGR TI 48-TSSOP New 详细
SN74LS258BN TI 16-PDIP New 详细
BQ24260YFFR TI 36-DSBGA New 详细
SN75176AP TI 8-PDIP New 详细
AM3505AZER TI 484-BGA (23x23) New 详细
LP2980IM5-3.3/NOPB TI SOT-23-5 New 详细
DS92LV090ATVEH/NOPB TI 64-TQFP (10x10) New 详细
DAC0832LCWM TI 20-SOIC New 详细
PTH12010YAS TI New 详细
TPS54240DGQR TI 10-MSOP-PowerPad New 详细
TLC2274AMDREP TI 14-SOIC New 详细
LM3S628-EGZ50-C2 TI 48-VQFN (7x7) New 详细
SN74ABT2952ADWR TI 24-SOIC New 详细
TPS61107PW TI 20-TSSOP New 详细
TLV74311PDBVR TI SOT-23-5 New 详细
LM25115SDX TI 16-WSON (5x5) New 详细
LM3S3W26-IQR50-C3T TI 64-LQFP (10x10) New 详细
TMP300BIDBVT TI SOT-23-6 New 详细