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TMS470R1B768PGET
- Manufacturer : Texas Instruments
Packaging : Tray
Series : TMS470
Part Status : Not For New Designs
Core Processor : ARM7?
Core Size : 16/32-Bit
Speed : 60MHz
Connectivity : CANbus, SCI, SPI
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 86
Program Memory Size : 768KB (768K x 8)
Program Memory Type : FLASH
RAM Size : 48K x 8
Voltage - Supply (Vcc/Vdd) : 1.81V ~ 2.05V
Data Converters : A/D 16x10b
Oscillator Type : External
Operating Temperature : -40°C ~ 105°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| CD74HC190PWT | TI | 16-TSSOP | New | 详细 | |
| CD4035BNSRG4 | TI | 16-SO | New | 详细 | |
| UCC38C41DGK | TI | 8-VSSOP | New | 详细 | |
| DEVPACK-LED-AUDIO | TI | New | 详细 | ||
| TMS320DM648ZUTD9 | TI | 529-FCBGA (19x19) | New | 详细 | |
| SN74ABT5403DWG4 | TI | 28-SOIC | New | 详细 | |
| MSP430F412IPM | TI | 64-LQFP (10x10) | New | 详细 | |
| LMP7701MFX/NOPB | TI | SOT-23-5 | New | 详细 | |
| ADS4129IRGZ25 | TI | 48-VQFN (7x7) | New | 详细 | |
| LP38512TJ-ADJ/NOPB | TI | TO-263-5 Thin | New | 详细 | |
| SN65HVD232DG4 | TI | 8-SOIC | New | 详细 | |
| CD74HC173NSR | TI | New | 详细 | ||
| TLC2262AQDRG4 | TI | 8-SOIC | New | 详细 | |
| LMX2364TM/NOPB | TI | 24-TSSOP | New | 详细 | |
| SN74LVC1G98DSFR | TI | 6-SON (1x1) | New | 详细 | |
| LP2950CZ-3.3/LFT1 | TI | TO-92-3 | New | 详细 | |
| TMS320C6743CPTPT3 | TI | 176-HLQFP (24x24) | New | 详细 | |
| SN74ABT574ANSR | TI | New | 详细 | ||
| P82B96D | TI | 8-SOIC | New | 详细 | |
| ADC081S021CISDX/NOPB | TI | 6-WSON (2.2x2.5) | New | 详细 |
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