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罗斌森
  • TLV9002IDSGR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 2
    Output Type : Rail-to-Rail
    Slew Rate : 2V/μs
    Gain Bandwidth Product : 1MHz
    Current - Input Bias : 5pA
    Voltage - Input Offset : 400μV
    Current - Supply : 60μA
    Voltage - Supply, Single/Dual (±) : 1.8V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 8-WFDFN Exposed Pad
    Supplier Device Package : 8-WSON (2x2)

极速报价

型号
品牌 封装 批号 查看
TAS5709APHPR TI 48-HTQFP (7x7) New 详细
LMS1487CMX/NOPB TI 8-SOIC New 详细
TPS51678RSMT TI 32-VQFN (4x4) New 详细
COP8SAA720M7 TI 20-SOIC New 详细
1P1G125QDCKRQ1 TI SC-70-5 New 详细
DS90C032TM/NOPB TI 16-SOIC New 详细
CD74AC273E TI New 详细
UC385TD-2 TI DDPAK/TO-263-5 New 详细
OPT101P-J TI 8-SOP New 详细
SN74AC86DBR TI 14-SSOP New 详细
TP3067N/NOPB TI 20-DIP New 详细
LM4040A30IDCKR TI SC-70-5 New 详细
SN74HC04DR TI 14-SOIC New 详细
LM567CN TI 8-PDIP New 详细
TPS62612YFDT TI 6-DSBGA (1.30x.93) New 详细
LMV7235M7 TI SC-70-5 New 详细
MSP430G2211IRSAQ1 TI 16-QFN (4x4) New 详细
UCC3957M-3 TI 16-SSOP New 详细
LMP90080QMH/NOPB TI 28-HTSSOP New 详细
SN74AS374DWRE4 TI New 详细