产品系列
TMX5702125APGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 58
Program Memory Size : 2MB (2M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 192K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| AM26C31CN | TI | 16-PDIP | New | 详细 | |
| SN74CBTLV16800DLR | TI | 48-SSOP | New | 详细 | |
| LM95231BIMMX-1/NOPB | TI | 8-VSSOP | New | 详细 | |
| SN74LS540DBR | TI | 20-SSOP | New | 详细 | |
| TPS7233QD | TI | 8-SOIC | New | 详细 | |
| LM2594HVN-5.0/NOPB | TI | 8-PDIP | New | 详细 | |
| SN65MLVD047D | TI | 16-SOIC | New | 详细 | |
| LP3964ESX-1.8 | TI | DDPAK/TO-263-5 | New | 详细 | |
| TPS3850G12QDRCRQ1 | TI | 10-VSON (3x3) | New | 详细 | |
| SN74AHC1GU04DRLR | TI | SOT-5 | New | 详细 | |
| LM4919MM/NOPB | TI | 10-VSSOP | New | 详细 | |
| LP3972SQX-I514/NOPB | TI | 40-LLP-EP (5x5) | New | 详细 | |
| LM3674MF-1.5/NOPB | TI | SOT-23-5 | New | 详细 | |
| MSP-FET430U100USB | TI | New | 详细 | ||
| LM3S9792-IQC80-C1 | TI | 100-LQFP (14x14) | New | 详细 | |
| BQ24133RGYT | TI | 24-VQFN (5.5x3.5) | New | 详细 | |
| ISO5851DW | TI | 16-SOIC | New | 详细 | |
| TIOS1015EVM | TI | New | 详细 | ||
| LMV321AIDBVR | TI | SOT-23-5 | New | 详细 | |
| BQ296111DSGT | TI | 8-WSON (2x2) | New | 详细 |
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