产品系列
TMX5702125APGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 58
Program Memory Size : 2MB (2M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 192K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| RI-I16-112A | TI | New | 详细 | ||
| TMS320C54V90APGE | TI | 144-LQFP (20x20) | New | 详细 | |
| LM3686TLX-AAED/NOPB | TI | 12-DSBGA | New | 详细 | |
| SN74ACT373DWR | TI | 20-SOIC | New | 详细 | |
| SN65C3232EDWR | TI | 16-SOIC | New | 详细 | |
| TPS62110QRSAREP | TI | 16-QFN (4x4) | New | 详细 | |
| TPS2003CDRCR | TI | 10-VSON (3x3) | New | 详细 | |
| LM2598SX-5.0/NOPB | TI | DDPAK/TO-263-7 | New | 详细 | |
| TPS73118DBVR | TI | SOT-23-5 | New | 详细 | |
| ADS8329IRSAR | TI | 16-QFN (4x4) | New | 详细 | |
| XOMAP3525BCUS | TI | 423-FCBGA (16x16) | New | 详细 | |
| PCA9536D | TI | 8-SOIC | New | 详细 | |
| LM2575SX-15/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| ULN2002AN | TI | 16-PDIP | New | 详细 | |
| TP3071N-G/NOPB | TI | 20-DIP | New | 详细 | |
| TRS3222ECDBR | TI | 20-SSOP | New | 详细 | |
| DCP012405BP-U | TI | New | 详细 | ||
| TMP175AID | TI | 8-SOIC | New | 详细 | |
| ADS54J42IRMP | TI | 72-VQFN (10x10) | New | 详细 | |
| INA129PA | TI | 8-PDIP | New | 详细 |
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