产品系列
TMX5703134BPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 64
Program Memory Size : 2MB (2M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| MSP430F1232IDW | TI | 28-SOIC | New | 详细 | |
| BQ24400DG4 | TI | 8-SOIC | New | 详细 | |
| LM7131ACMX | TI | 8-SOIC | New | 详细 | |
| LP2951CN/NOPB | TI | 8-PDIP | New | 详细 | |
| BQ24620RVAR | TI | 16-VQFN (3.5x3.5) | New | 详细 | |
| LM2750LDX-ADJ | TI | 10-WSON (3x3) | New | 详细 | |
| LP3972SQE-E514/NOPB | TI | 40-WQFN (5x5) | New | 详细 | |
| LP3963ES-3.3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| SN74AUC74RGYR | TI | New | 详细 | ||
| SN74LVC1G86YEPR | TI | 5-DSBGA, 5-WCSP (1.4x0.9) | New | 详细 | |
| PCA9539DBR | TI | 24-SSOP | New | 详细 | |
| RC4580ID | TI | 8-SOIC | New | 详细 | |
| TRSF3222ECDBR | TI | 20-SSOP | New | 详细 | |
| DRV5013ADQDBZR | TI | SOT-23-3 | New | 详细 | |
| ADS8924BRGET | TI | 24-VQFN (4x4) | New | 详细 | |
| MAX3221IPWRG4 | TI | 16-TSSOP | New | 详细 | |
| LM2679T-5.0 | TI | TO-220-7 | New | 详细 | |
| LP2985IM5-3.1 | TI | SOT-23-5 | New | 详细 | |
| TLV2369IDGKR | TI | 8-VSSOP | New | 详细 | |
| SN74CBT3244DGVR | TI | 20-TVSOP | New | 详细 |
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