产品系列
TMX5703137AZWTQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 180MHz
Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 120
Program Memory Size : 3MB (3M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 337-LFBGA
Supplier Device Package : 337-NFBGA (16x16)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
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| SN74LVCH16244AGRDR | TI | 54-BGA MICROSTAR JUNIOR (8.0x5.5) | New | 详细 | |
| TPS2211IDB | TI | 16-SSOP | New | 详细 | |
| LM3S1F11-IBZ50-A1T | TI | 108-BGA (10x10) | New | 详细 | |
| DAC712PLG4 | TI | 28-PDIP | New | 详细 | |
| LM3S8C62-IBZ80-A1T | TI | 108-BGA (10x10) | New | 详细 | |
| TPIC1021D | TI | 8-SOIC | New | 详细 | |
| LM1086ISX-3.3/NOPB | TI | DDPAK/TO-263-3 | New | 详细 | |
| LM2653MTC-ADJ | TI | 16-TSSOP | New | 详细 | |
| LM393PWR | TI | 8-TSSOP | New | 详细 | |
| LM3S1332-IBZ50-A2 | TI | 108-BGA (10x10) | New | 详细 | |
| INA129MDREP | TI | 8-SOIC | New | 详细 | |
| LM9833CCVJD/NOPB | TI | 100-TQFP (14x14) | New | 详细 | |
| UA7905CKCS | TI | TO-220-3 | New | 详细 | |
| ISO7831FDW | TI | 16-SOIC | New | 详细 | |
| TMDSHVMTRINSPIN | TI | New | 详细 | ||
| UCC3803PW | TI | 8-TSSOP | New | 详细 |
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