型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TLV73315PDBVT | TI | SOT-23-5 | New | 详细 | |
| RI-I16-114A-S1 | TI | New | 详细 | ||
| MSP430F5229IRGCR | TI | 64-VQFN (9x9) | New | 详细 | |
| TPS62421DRCR | TI | 10-VSON (3x3) | New | 详细 | |
| TMS320C25FNL50 | TI | 68-PLCC (24.23x24.23) | New | 详细 | |
| DS90CR215MTDX/NOPB | TI | 48-TSSOP | New | 详细 | |
| PCM1864EVM | TI | New | 详细 | ||
| UC385TDKTTT-ADJ | TI | DDPAK/TO-263-5 | New | 详细 | |
| TB5D1MDRG4 | TI | 16-SOIC | New | 详细 | |
| LP5900TL-2.85/NOPB | TI | 4-DSBGA (1x1) | New | 详细 | |
| LP3873ESX-1.8 | TI | DDPAK/TO-263-5 | New | 详细 | |
| CDCF2509PW | TI | 24-TSSOP | New | 详细 | |
| ADC12DL040CIVS/NOPB | TI | 64-TQFP (10x10) | New | 详细 | |
| TPA3001D1PWP | TI | 24-HTSSOP | New | 详细 | |
| MSP430G2231QPW1EP | TI | 14-TSSOP | New | 详细 | |
| TMDS171RGZEVM | TI | New | 详细 | ||
| LP3965ESX-2.5/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| OPA699ID | TI | 8-SOIC | New | 详细 | |
| UCC27211D | TI | 8-SOIC | New | 详细 | |
| LM3S300-EQN25-C2 | TI | 48-LQFP (7x7) | New | 详细 |