产品系列
产品系列
TPL7407LAPWR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : *
Part Status : Active
Package / Case : 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package : 16-TSSOP
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74ALVC16334DLR | TI | 48-SSOP | New | 详细 | |
| LM3S1N11-IQC50-C1T | TI | 100-LQFP (14x14) | New | 详细 | |
| LM3622MX-4.2 | TI | 8-SOIC | New | 详细 | |
| LM1085IS-3.3/NOPB | TI | DDPAK/TO-263-3 | New | 详细 | |
| ADS62C15IRGCT | TI | 64-VQFN (9x9) | New | 详细 | |
| OPA189IDR | TI | 8-SOIC | New | 详细 | |
| TM4C1231C3PMI | TI | 64-LQFP (10x10) | New | 详细 | |
| TPS2115APW | TI | 8-TSSOP | New | 详细 | |
| TRS211CDWR | TI | 28-SOIC | New | 详细 | |
| MAX3222CDB | TI | 20-SSOP | New | 详细 | |
| TL3845BD-8 | TI | 8-SOIC | New | 详细 | |
| AM3894ACYG120 | TI | 1031-FCBGA (25x25) | New | 详细 | |
| SN74LVC2G240YZAR | TI | 8-DSBGA, 8-WCSP (1.9x0.9) | New | 详细 | |
| DRV8302-HC-C2-KIT | TI | New | 详细 | ||
| ADS7888EVM | TI | New | 详细 | ||
| SN74AS876DWE4 | TI | New | 详细 | ||
| TLV2474AID | TI | 14-SOIC | New | 详细 | |
| UCC27714EVM-551 | TI | New | 详细 | ||
| LMV358M | TI | 8-SOIC | New | 详细 | |
| TAS3202PAG | TI | 64-TQFP (10x10) | New | 详细 |
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