罗斌森
  • TPS1H000AQDGNRQ1

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Package / Case : 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
    Supplier Device Package : 8-MSOP-PowerPad

极速报价

型号
品牌 封装 批号 查看
TPS76633DR TI 8-SOIC New 详细
LM3S5G31-IBZ80-A1T TI 108-BGA (10x10) New 详细
LMS1587IS-1.5 TI DDPAK/TO-263-3 New 详细
TRS3318CDBG4 TI 20-SSOP New 详细
TMP411DQDGKRQ1 TI 8-VSSOP New 详细
CD4503BPWRG4 TI 16-TSSOP New 详细
ADS5401EVM TI New 详细
SN74CBT3245CDBQR TI 20-SSOP/QSOP New 详细
RC4136N TI 14-PDIP New 详细
LM3S1J16-IQR50-C0 TI 64-LQFP (10x10) New 详细
CD4093BPWR TI 14-TSSOP New 详细
LM75CIMM-3/NOPB TI 8-VSSOP New 详细
THS5671AIDWR TI 28-SOIC New 详细
LM2587T-12 TI TO-220-5 New 详细
UCC3751NG4 TI 16-PDIP New 详细
TPS40054PWPG4 TI 16-HTSSOP New 详细
TPS2561ADRCT TI 10-VSON (3x3) New 详细
TP3057BDW TI 16-SOIC New 详细
DM3730CBPA TI 515-POP-FCBGA (12x12) New 详细
TPS3700QDSERQ1 TI 6-WSON (1.5x1.5) New 详细