产品系列
TMS5700714APGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Alternate Packaging
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Active
Core Processor : ARM? Cortex?-R4F
Core Size : 32-Bit Dual-Core
Speed : 160MHz
Connectivity : CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 64
Program Memory Size : 768KB (768K x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 128K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN65HVD231D | TI | 8-SOIC | New | 详细 | |
| DS75176BM/NOPB | TI | 8-SOIC | New | 详细 | |
| TPA2016D2YZHR | TI | 16-DSBGA (2.24x2.16) | New | 详细 | |
| TMS320F28PLC84PNTR | TI | 80-LQFP (12x12) | New | 详细 | |
| DCV010512DP-U/700 | TI | New | 详细 | ||
| TPS259240DRCT | TI | 10-VSON (3x3) | New | 详细 | |
| TPS2501EVM-337 | TI | New | 详细 | ||
| MAX3232ECPW | TI | 16-TSSOP | New | 详细 | |
| DRV8402DKD | TI | 36-HSSOP | New | 详细 | |
| TLV320DAC23RHDR | TI | 28-VQFN (5x5) | New | 详细 | |
| LMC6024IM | TI | 14-SOIC | New | 详细 | |
| DS3695AMX | TI | 8-SOIC | New | 详细 | |
| REF5010ID | TI | 8-SOIC | New | 详细 | |
| AMC1204BDWR | TI | 16-SOIC | New | 详细 | |
| PT78ST112H | TI | New | 详细 | ||
| CD74HC85E | TI | New | 详细 | ||
| GD75232DWR | TI | 20-SOIC | New | 详细 | |
| SN74S37DR | TI | 14-SOIC | New | 详细 | |
| TPS546C20AEVM1-746 | TI | New | 详细 | ||
| TPS2041CDBVT | TI | SOT-23-5 | New | 详细 |
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