产品系列
TMS5700714APGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Alternate Packaging
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Active
Core Processor : ARM? Cortex?-R4F
Core Size : 32-Bit Dual-Core
Speed : 160MHz
Connectivity : CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 64
Program Memory Size : 768KB (768K x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 128K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| CDC421212RGETG4 | TI | 24-VQFN (4x4) | New | 详细 | |
| LM2591HVS-5.0 | TI | DDPAK/TO-263-5 | New | 详细 | |
| THS6072IDGNR | TI | 8-MSOP-PowerPad | New | 详细 | |
| RM48L952PGET | TI | 144-LQFP (20x20) | New | 详细 | |
| TLV70530YFPR | TI | 4-DSBGA (0.8x0.8) | New | 详细 | |
| TM4C129ENCPDTT3 | TI | 128-TQFP (14x14) | New | 详细 | |
| LMH6515SQ/NOPB | TI | 16-WQFN (4x4) | New | 详细 | |
| LP5907UVE-2.85/NOPB | TI | 4-DSBGA | New | 详细 | |
| TPS54290PWPR | TI | 16-HTSSOP | New | 详细 | |
| INA216A3RSWT | TI | 10-UQFN (1.8x1.4) | New | 详细 | |
| TLV74128PDBVR | TI | SOT-23-5 | New | 详细 | |
| TPS2013APWPR | TI | 14-HTSSOP | New | 详细 | |
| SN65HVD22D | TI | 8-SOIC | New | 详细 | |
| TPS7150QPW | TI | 20-TSSOP | New | 详细 | |
| SN74AUC16244GQLR | TI | 56-BGA MICROSTAR JUNIOR (7.0x4.5) | New | 详细 | |
| SN74ABTH16244DGGR | TI | 48-TSSOP | New | 详细 | |
| BQ25700ARSNT | TI | 32-QFN (4x4) | New | 详细 | |
| LM8330EVM | TI | New | 详细 | ||
| TLC251CPSR | TI | 8-SO | New | 详细 | |
| LMH6715MAX/NOPB | TI | 8-SOIC | New | 详细 |
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