产品系列
TMS5700714APGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Alternate Packaging
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Active
Core Processor : ARM? Cortex?-R4F
Core Size : 32-Bit Dual-Core
Speed : 160MHz
Connectivity : CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 64
Program Memory Size : 768KB (768K x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 128K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
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| TMX320C6670AXCYP | TI | 841-FCBGA (24x24) | New | 详细 | |
| AMC1304L25EVM | TI | New | 详细 | ||
| ONET2511TAY | TI | Diesale | New | 详细 | |
| SN74HCU04D | TI | 14-SOIC | New | 详细 | |
| LM3475EVAL | TI | New | 详细 | ||
| LM258AD | TI | 8-SOIC | New | 详细 | |
| TLV75729PDBVR | TI | SOT-23-5 | New | 详细 | |
| ADS820U | TI | 28-SOIC | New | 详细 | |
| SN74F2373DW | TI | 20-SOIC | New | 详细 | |
| 88SR112HD | TI | SIP Module-3 | New | 详细 | |
| SN74AS808BN | TI | 20-PDIP | New | 详细 | |
| TPS7301QPWR | TI | 20-TSSOP | New | 详细 | |
| LM3354MM-5.0/NOPB | TI | 10-VSSOP | New | 详细 | |
| SN74AC240NSR | TI | 20-SO | New | 详细 | |
| TRF7962RHBR | TI | New | 详细 | ||
| ADS7810U/1KG4 | TI | 28-SOIC | New | 详细 | |
| TX810EVM | TI | New | 详细 | ||
| DS26LV32ATM/NOPB | TI | 16-SOIC | New | 详细 |
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