产品系列
TMS5701114CPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Active
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 64
Program Memory Size : 1MB (1M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 128K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LP3874ES-1.8/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| TRF1223IRTMR | TI | 32-VQFN (5x5) | New | 详细 | |
| TPS22914BYFPT | TI | 4-DSBGA | New | 详细 | |
| LM2758TL/NOPB | TI | 12-μSMD (1.49x2) | New | 详细 | |
| LM6211MFX | TI | SOT-23-5 | New | 详细 | |
| TPS60400EVM-178 | TI | New | 详细 | ||
| LM3526M-H | TI | 8-SOIC | New | 详细 | |
| LM2590HVS-3.3 | TI | DDPAK/TO-263-7 | New | 详细 | |
| SN74CBTD3384CDBR | TI | 24-SSOP | New | 详细 | |
| SM320C6455BGTZSEP | TI | 697-FCBGA (24x24) | New | 详细 | |
| LM2830ZSDX/NOPB | TI | 6-WSON (3x3) | New | 详细 | |
| LMV722MMX/NOPB | TI | 8-VSSOP | New | 详细 | |
| TLK1201AIRCPR | TI | 64-HVQFP | New | 详细 | |
| SN74AUP2G08DCUR | TI | US8 | New | 详细 | |
| ISO7721FD | TI | 8-SOIC | New | 详细 | |
| LP2960AIMX-3.3/NOPB | TI | 16-SOIC | New | 详细 | |
| COP8CBR9HVA8 | TI | 44-PLCC (16.58x16.58) | New | 详细 | |
| TMS320C542PGE1-40 | TI | 144-LQFP (20x20) | New | 详细 | |
| TPS54526PWP | TI | 14-HTSSOP | New | 详细 | |
| TLV2474AIDR | TI | 14-SOIC | New | 详细 |
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