产品系列
TMS5701115BPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 58
Program Memory Size : 1MB (1M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 128K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| DS14C232CN | TI | 16-PDIP | New | 详细 | |
| MSP430F147IRTDT | TI | 64-VQFN (9x9) | New | 详细 | |
| LM2592HVSX-ADJ/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| LMC6484AIN/NOPB | TI | 14-DIP | New | 详细 | |
| TLV2374MDREP | TI | 14-SOIC | New | 详细 | |
| LM4040DIZ-3.0/NOPB | TI | TO-92-3 | New | 详细 | |
| TLV73333PQDRVRQ1 | TI | 6-WSON (2x2) | New | 详细 | |
| LMH6643MMX/NOPB | TI | 8-VSSOP | New | 详细 | |
| TPS2383APM | TI | 64-LQFP (10x10) | New | 详细 | |
| TPS23752EVM-145 | TI | New | 详细 | ||
| ADC0820BCWMX/NOPB | TI | 20-SOIC | New | 详细 | |
| THS3062DDARG3 | TI | 8-SO PowerPad | New | 详细 | |
| UCC5618DWPTRG4 | TI | 28-SOIC | New | 详细 | |
| TPS78925DBVR | TI | SOT-23-5 | New | 详细 | |
| INA190A1IRSWT | TI | 10-UQFN (1.8x1.4) | New | 详细 | |
| TLV2244IPW | TI | 14-TSSOP | New | 详细 | |
| CD74ACT138E | TI | 16-PDIP | New | 详细 | |
| LMC7101BIM5 | TI | SOT-23-5 | New | 详细 | |
| LM3554TMEEV/NOPB | TI | New | 详细 | ||
| REF3030AIDBZR | TI | SOT-23-3 | New | 详细 |
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