产品系列
TMS5701224BPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 64
Program Memory Size : 1.25MB (1.25M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 192K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| ADS1299IPAG | TI | 64-TQFP (10x10) | New | 详细 | |
| DAC7718EVM | TI | New | 详细 | ||
| ULN2004AIN | TI | 16-PDIP | New | 详细 | |
| SN74HCT257D | TI | 16-SOIC | New | 详细 | |
| LM26CIM5X-YPE/NOPB | TI | SOT-23-5 | New | 详细 | |
| SN74LVCH16543ADGVR | TI | 56-TVSOP | New | 详细 | |
| SN65LV1023DBRG4 | TI | 28-SSOP | New | 详细 | |
| LM2940CS-12/NOPB | TI | DDPAK/TO-263-3 | New | 详细 | |
| LM3S1608-IQC50-A2 | TI | 100-LQFP (14x14) | New | 详细 | |
| UCD9244ARGCR | TI | 64-VQFN (9x9) | New | 详细 | |
| CC2510F8RSPR | TI | 36-VQFN (6x6) | New | 详细 | |
| CD4011UBM | TI | 14-SOIC | New | 详细 | |
| REF5025IDR | TI | 8-SOIC | New | 详细 | |
| LM3670MF-1.875/NOPB | TI | SOT-23-5 | New | 详细 | |
| TSC2301IGQZR | TI | 120-BGA Microstar Junior (6x6) | New | 详细 | |
| DAC7811IDGST | TI | 10-VSSOP | New | 详细 | |
| TPS2062D | TI | 8-SOIC | New | 详细 | |
| LM536013QDSXTQ1 | TI | 10-WSON (3x3) | New | 详细 | |
| UCC29002DR | TI | 8-SOIC | New | 详细 | |
| LM2695SDX/NOPB | TI | 10-WSON (4x4) | New | 详细 |
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