产品系列
TMS5701224BPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 64
Program Memory Size : 1.25MB (1.25M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 192K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TS3USB221RSER | TI | 10-UQFN (2.0x1.5) | New | 详细 | |
| UCC28061D | TI | 16-SOIC | New | 详细 | |
| CD4572UBM96G4 | TI | 16-SOIC | New | 详细 | |
| TSC2046EVM | TI | New | 详细 | ||
| SN74AHCT125DGVR | TI | 14-TVSOP | New | 详细 | |
| TLV70235DBVR | TI | SOT-23-5 | New | 详细 | |
| LM258DG4 | TI | 8-SOIC | New | 详细 | |
| TPS2046DR | TI | 8-SOIC | New | 详细 | |
| THS3001HVIDGN | TI | 8-MSOP-PowerPad | New | 详细 | |
| LMV358Q1MAX/NOPB | TI | 8-SOIC | New | 详细 | |
| CD4009UBE | TI | 16-PDIP | New | 详细 | |
| TRS202IPWR | TI | 16-TSSOP | New | 详细 | |
| LM22676MR-5.0/NOPB | TI | 8-SO PowerPad | New | 详细 | |
| OPA2137UA/2K5 | TI | 8-SOIC | New | 详细 | |
| TLV320AIC3212IYZFR | TI | 81-DSBGA (4.81x4.81) | New | 详细 | |
| CY74FCT191ATSOCTE4 | TI | 16-SOIC | New | 详细 | |
| LP8556TMX-E06/NOPB | TI | 20-DSBGA (2.04x1.78) | New | 详细 | |
| SN74LVC1G97DBVT | TI | SOT-23-6 | New | 详细 | |
| CD4022BE | TI | 16-PDIP | New | 详细 | |
| COP8SDR9IMT8 | TI | 48-TSSOP | New | 详细 |
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