产品系列
TMS5701225BZWTQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 180MHz
Connectivity : CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 101
Program Memory Size : 1.25MB (1.25M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 192K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 337-LFBGA
Supplier Device Package : 337-NFBGA (16x16)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LMX2354TM/NOPB | TI | 24-TSSOP | New | 详细 | |
| TL082ACPSR | TI | 8-SO | New | 详细 | |
| TPS92518QPWPRQ1 | TI | 24-HTSSOP | New | 详细 | |
| LM3S600-EQN50-C2 | TI | 48-LQFP (7x7) | New | 详细 | |
| LM3480IM3X-5.0/NOPB | TI | SOT-23-3 | New | 详细 | |
| LM3S9790-IQC80-C1T | TI | 100-LQFP (14x14) | New | 详细 | |
| LM1086CS-5.0/NOPB | TI | DDPAK/TO-263-3 | New | 详细 | |
| LP3874ES-1.8/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| DAC8803EVM | TI | New | 详细 | ||
| TPS7A1010PYKAR | TI | 5-DSBGA | New | 详细 | |
| LM27213SQX/NOPB | TI | 48-WQFN (7x7) | New | 详细 | |
| MSP430F5328IRGCT | TI | 64-VQFN (9x9) | New | 详细 | |
| TMS320DM6467CCUTAV | TI | 529-FCBGA (19x19) | New | 详细 | |
| TPS54336EVM-556 | TI | New | 详细 | ||
| TPA6120A2DWPG4 | TI | 20-SO PowerPad | New | 详细 | |
| LM2594HVMX-5.0/NOPB | TI | 8-SOIC | New | 详细 | |
| TL5001ACD | TI | 8-SOIC | New | 详细 | |
| LM5068MMX-3/NOPB | TI | 8-VSSOP | New | 详细 | |
| BQ2012SN-D107TR | TI | 16-SOIC | New | 详细 | |
| SN74AHCT1G02DCKT | TI | SC-70-5 | New | 详细 |
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