产品系列
TMS5703134CPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 64
Program Memory Size : 3MB (3M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TMS320VC5509PGE31 | TI | 144-LQFP (20x20) | New | 详细 | |
| LP38691DT-2.5/NOPB | TI | TO-252-3 | New | 详细 | |
| ISO7760DBQ | TI | 16-SSOP | New | 详细 | |
| HD3SS3411RWAEVM | TI | New | 详细 | ||
| REF3140AQDBZRQ1 | TI | SOT-23-3 | New | 详细 | |
| THS4141IDGKR | TI | 8-VSSOP | New | 详细 | |
| OPA4170AIPW | TI | 14-TSSOP | New | 详细 | |
| LP38841S-1.5/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| TNETE2201BPJW | TI | 64-HTQFP (10x10) | New | 详细 | |
| TPS40200D | TI | 8-SOIC | New | 详细 | |
| REG103FA-2.5 | TI | DDPAK/TO-263-5 | New | 详细 | |
| TLV2770CP | TI | 8-PDIP | New | 详细 | |
| CD74HCT86E | TI | 14-PDIP | New | 详细 | |
| TPS61055DRCT | TI | 10-VSON (3x3) | New | 详细 | |
| 78HT253HC | TI | New | 详细 | ||
| MSP430F5232IRGZT | TI | 48-VQFN (7x7) | New | 详细 | |
| 551600610-001/NOPB | TI | New | 详细 | ||
| LM43600AQPWPTQ1 | TI | 16-HTSSOP | New | 详细 | |
| LM3448MA/NOPB | TI | 16-SOIC | New | 详细 | |
| TPS2811DR | TI | 8-SOIC | New | 详细 |
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