产品系列
TMS5703135CZWTQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 180MHz
Connectivity : CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 120
Program Memory Size : 3MB (3M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 337-LFBGA
Supplier Device Package : 337-NFBGA (16x16)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM2677SD-12/NOPB | TI | 14-VSON (5x6) | New | 详细 | |
| THS3001HVCDGNRG4 | TI | 8-MSOP-PowerPad | New | 详细 | |
| TS5A23159DGSR | TI | 10-VSSOP | New | 详细 | |
| TRSF3221CPW | TI | 16-TSSOP | New | 详细 | |
| LM4120IM5X-5.0/NOPB | TI | SOT-23-5 | New | 详细 | |
| TPA3122D2EVM | TI | New | 详细 | ||
| DAC39J84EVM | TI | New | 详细 | ||
| TM4C123GH6ZRBT | TI | 157-BGA MicroStar Jr (9x9) | New | 详细 | |
| TPA2006D1EVM | TI | New | 详细 | ||
| LM810M3X-4.00/NOPB | TI | SOT-23-3 | New | 详细 | |
| TLV2252AIP | TI | 8-PDIP | New | 详细 | |
| SN74AHCT08QDRG4Q1 | TI | 14-SOIC | New | 详细 | |
| CY74FCT257CTSOCTE4 | TI | 16-SOIC | New | 详细 | |
| LP3907TLX-JJCP/NOPB | TI | 25-uSMD | New | 详细 | |
| LP3872EMP-5.0/NOPB | TI | SOT-223-5 | New | 详细 | |
| SN74AHCT1G14DCKR | TI | SC-70-5 | New | 详细 | |
| TL431LIBQDBZR | TI | New | 详细 | ||
| LP3875EMP-1.8/NOPB | TI | SOT-223-5 | New | 详细 | |
| LP2985IBL-1.8 | TI | 5-μSMD (1.03x1.41) | New | 详细 | |
| DAC7731E | TI | 24-SSOP | New | 详细 |
请把您的采购需求告诉我们！
Copyright © 2007-2021 All Rights Reserved. - 深圳市罗斌森电子科技有限公司
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
网站设计webdesign www.wzdzkf.com