产品系列
TMS5703137BPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 58
Program Memory Size : 3MB (3M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| MSP430FR2522IRHLR | TI | 20-VQFN (3.5x4.5) | New | 详细 | |
| TPS7A8500ARGRR | TI | 20-VQFN (3.5x3.5) | New | 详细 | |
| LP8345ILD-ADJ/NOPB | TI | 6-WSON (2.92x3.29) | New | 详细 | |
| SN74AS825ADWRE4 | TI | New | 详细 | ||
| OPA1662AID | TI | 8-SOIC | New | 详细 | |
| INA333SJD | TI | 8-CDIP | New | 详细 | |
| TPS563210ADDFR | TI | TSOT-23-8 | New | 详细 | |
| OPA2836IDGSEVM | TI | New | 详细 | ||
| UCC27537DBVT | TI | SOT-23-5 | New | 详细 | |
| TLC2264QDRG4 | TI | 14-SOIC | New | 详细 | |
| SN74LVC1G86DCKT | TI | SC-70-5 | New | 详细 | |
| TLC1542CN | TI | 20-PDIP | New | 详细 | |
| XOMAP3530BCBC | TI | 515-POP-FCBGA (14x14) | New | 详细 | |
| UC2526AQG3 | TI | 20-PLCC (9x9) | New | 详细 | |
| MDL-BDC24 | TI | New | 详细 | ||
| LM2936M-3.3/NOPB | TI | 8-SOIC | New | 详细 | |
| CD74HC297EE4 | TI | New | 详细 | ||
| SN74LS19AD | TI | 14-SOIC | New | 详细 | |
| THVD1450DR | TI | 8-SOIC | New | 详细 | |
| ADC081000CIYB/NOPB | TI | 128-HLQFP (20x20) | New | 详细 |
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