产品系列
TMS5703137BZWTQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 180MHz
Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 120
Program Memory Size : 3MB (3M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 337-LFBGA
Supplier Device Package : 337-NFBGA (16x16)
型号 |
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|---|---|---|---|---|---|
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| LM1117IDTX-ADJ/NOPB | TI | TO-252-3 | New | 详细 | |
| LP3856ESX-1.8 | TI | DDPAK/TO-263-5 | New | 详细 | |
| LMP8671MAX/NOPB | TI | 8-SOIC | New | 详细 | |
| TPS51125RGET | TI | 24-VQFN (4x4) | New | 详细 | |
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| OPA548F/500 | TI | DDPAK/TO-263-7 | New | 详细 | |
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| DRV401AIDWPR | TI | 20-SO PowerPad | New | 详细 | |
| ADS124S06IRHBR | TI | 32-VQFN (5x5) | New | 详细 | |
| LMH2100TM/NOPB | TI | 6-DSBGA | New | 详细 | |
| LP5951MG-3.0 | TI | SC-70-5 | New | 详细 | |
| TPS61013EVM-157 | TI | New | 详细 | ||
| BQ20Z70PWR-V110 | TI | 20-TSSOP | New | 详细 | |
| SN74LVC863ADBRG4 | TI | 24-SSOP | New | 详细 | |
| SN74AUC1G19DRLR | TI | 6-SOT | New | 详细 | |
| CD74FCT843AM96E4 | TI | 24-SOIC | New | 详细 |
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