产品系列
TMS5703137CGWTQEP
- Manufacturer : Texas Instruments
Packaging : Tube
Series : Hercules? TMS570 ARM? Cortex?-R
Part Status : Active
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 180MHz
Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 120
Program Memory Size : 3MB (3M x 8)
Program Memory Type : FLASH
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 1.32V
Data Converters : A/D 16x12b, 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 337-LFBGA
Supplier Device Package : 337-NFBGA (16x16)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LP5900SD-2.7 | TI | 6-WSON (2.2x2.5) | New | 详细 | |
| TL4050A25QDCKR | TI | SC-70-5 | New | 详细 | |
| TPS7150QPWRG4 | TI | 20-TSSOP | New | 详细 | |
| TPS73618DCQG4 | TI | SOT-223-6 | New | 详细 | |
| ADS4126EVM | TI | New | 详细 | ||
| SN74S157DE4 | TI | 16-SOIC | New | 详细 | |
| INA199B1DCKR | TI | SC-70-6 | New | 详细 | |
| SN65LBC176AP | TI | 8-PDIP | New | 详细 | |
| AM26LS32AMDREP | TI | 16-SOIC | New | 详细 | |
| DLPA3005DPFD | TI | 100-HTQFP (14x14) | New | 详细 | |
| ADS6122IRHB25 | TI | 32-VQFN (5x5) | New | 详细 | |
| SN74CBTLV16800DLR | TI | 48-SSOP | New | 详细 | |
| BQ24901PWG4 | TI | 14-TSSOP | New | 详细 | |
| SN74BCT29827BDWR | TI | 24-SOIC | New | 详细 | |
| SN74CBT3245CDGVR | TI | 20-TVSOP | New | 详细 | |
| LM2595SX-ADJ/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| DAC7563SDGST | TI | 10-VSSOP | New | 详细 | |
| TSC2004IYZKR | TI | 24-DSBGA (2.57x2.57) | New | 详细 | |
| SN74LV32ANSR | TI | 14-SOP | New | 详细 | |
| LMV722M/NOPB | TI | 8-SOIC | New | 详细 |
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