产品系列

罗斌森
  • TMS5703137CGWTQEP

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Series : Hercules? TMS570 ARM? Cortex?-R
    Part Status : Active
    Core Processor : ARM? Cortex?-R4F
    Core Size : 16/32-Bit
    Speed : 180MHz
    Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
    Peripherals : DMA, POR, PWM, WDT
    Number of I/O : 120
    Program Memory Size : 3MB (3M x 8)
    Program Memory Type : FLASH
    RAM Size : 256K x 8
    Voltage - Supply (Vcc/Vdd) : 1.14V ~ 1.32V
    Data Converters : A/D 16x12b, 24x12b
    Oscillator Type : External
    Operating Temperature : -40°C ~ 125°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 337-LFBGA
    Supplier Device Package : 337-NFBGA (16x16)

极速报价

型号
品牌 封装 批号 查看
TPA2006D1DRBT TI 8-SON (3x3) New 详细
LM324N/PB TI 14-DIP New 详细
CY74FCT480BTPCG4 TI 24-PDIP New 详细
LM4894MMX/NOPB TI 10-VSSOP New 详细
UC3849DWTR TI 24-SOIC New 详细
TPS2202IDFR TI 30-SSOP New 详细
LP5910-1.2YKAR TI 4-DSBGA New 详细
SN74ALS867ADWRE4 TI 24-SOIC New 详细
SN65LVDS9638DGK TI 8-VSSOP New 详细
LM2678T-5.0 TI TO-220-7 New 详细
TPS61160ADRVT TI 6-WSON (2x2) New 详细
CD74HC194PWR TI 16-TSSOP New 详细
TL4050C25IDBZR TI SOT-23-3 New 详细
UC2909DWG4 TI 20-SOIC New 详细
ADS6149IRGZT TI 48-VQFN (7x7) New 详细
NE5534PSRE4 TI 8-SO New 详细
ADS5484EVM TI New 详细
SN74HC245PWR TI 20-TSSOP New 详细
LP3875ESX-ADJ TI DDPAK/TO-263-5 New 详细
ADC0803LCN TI 20-DIP New 详细