产品系列
TMS5703137CZWTQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 180MHz
Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 120
Program Memory Size : 3MB (3M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 337-LFBGA
Supplier Device Package : 337-NFBGA (16x16)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74LVC1G06DRLR | TI | SOT-5 | New | 详细 | |
| TL431BCLPME3 | TI | TO-92-3 | New | 详细 | |
| TVS2200DRVR | TI | 6-WSON (2x2) | New | 详细 | |
| SN74AUC1G19YEPR | TI | 6-DSBGA, 6-WCSP (1.4x0.9) | New | 详细 | |
| 74AUC2G241DCURG4 | TI | US8 | New | 详细 | |
| LM2588S-12/NOPB | TI | DDPAK/TO-263-7 | New | 详细 | |
| SN74HCT04NSR | TI | 14-SOP | New | 详细 | |
| LMZ12008TZX/NOPB | TI | New | 详细 | ||
| LM5111-3MX/NOPB | TI | 8-SOIC | New | 详细 | |
| DRV8833EVM | TI | New | 详细 | ||
| THS4551IRGTT | TI | 16-VQFN (3x3) | New | 详细 | |
| LP3855EMP-1.8/NOPB | TI | SOT-223-5 | New | 详细 | |
| LP3856ET-ADJ | TI | TO-220-5 | New | 详细 | |
| SN74CBT3253CDBR | TI | 16-SSOP | New | 详细 | |
| TMS320F28235ZJZS | TI | 176-BGA (15x15) | New | 详细 | |
| ADS5527IRGZT | TI | 48-VQFN (7x7) | New | 详细 | |
| TPS61060YZFR | TI | 8-DSBGA | New | 详细 | |
| LM3000ASQ/NOPB | TI | 32-WQFN (5x5) | New | 详细 | |
| SN65LVPE502RGER | TI | 24-VQFN (4x4) | New | 详细 | |
| SN74LVCH245ARGYR | TI | 20-VQFN (3.5x4.5) | New | 详细 |
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