产品系列
TMS5703137DPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Active
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 58
Program Memory Size : 3MB (3M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
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|---|---|---|---|---|---|
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| DP83848CVV/NOPB | TI | 48-LQFP (7x7) | New | 详细 | |
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| BQ24090DGQT | TI | 10-MSOP-PowerPad | New | 详细 | |
| CDCM6100XEVM | TI | New | 详细 | ||
| SN74V3680-7PEU | TI | 128-LQFP (14x20) | New | 详细 | |
| SN74LS298DR | TI | 16-SOIC | New | 详细 | |
| LM2831XMF/NOPB | TI | SOT-23-5 | New | 详细 | |
| SN65MLVD201DR | TI | 8-SOIC | New | 详细 | |
| TLC3704CN | TI | 14-PDIP | New | 详细 | |
| LM3S1811-IBZ50-C3 | TI | 108-BGA (10x10) | New | 详细 |
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