产品系列
TMS5704357BZWTQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Active
Core Processor : ARM? Cortex?-R5F
Core Size : 32-Bit
Speed : 300MHz
Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 145
Program Memory Size : 4MB (4M x 8)
Program Memory Type : FLASH
EEPROM Size : 128K x 8
RAM Size : 512K x 8
Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
Data Converters : A/D 41x12b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 337-LFBGA
Supplier Device Package : 337-NFBGA (16x16)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TPS65073RSLR | TI | 48-VQFN (6x6) | New | 详细 | |
| TPS62320YZDR | TI | 8-DSBGA (2.3x1.3) | New | 详细 | |
| SN74ALVCH162334VR | TI | 48-TVSOP | New | 详细 | |
| INA2126UA | TI | 16-SOIC | New | 详细 | |
| TS5A3157DBVR | TI | SOT-23-6 | New | 详细 | |
| CD74HC4050NSR | TI | 16-SO | New | 详细 | |
| SN74ABT623NSRG4 | TI | 20-SO | New | 详细 | |
| MSP-TS430RGC64C | TI | New | 详细 | ||
| TMX320DM355ZCE216 | TI | 337-NFBGA (13x13) | New | 详细 | |
| CSD17559Q5 | TI | 8-VSON-CLIP (5x6) | New | 详细 | |
| LMV1012UPX-07/NOPB | TI | 4-DSBGA | New | 详细 | |
| SN74LVC125ANSR | TI | 14-SOP | New | 详细 | |
| AM1806EZCE4 | TI | 361-NFBGA (13x13) | New | 详细 | |
| SN74AS174DRG4 | TI | New | 详细 | ||
| UCC24610EVM-563 | TI | New | 详细 | ||
| DS22EV5110-EVKH | TI | New | 详细 | ||
| LP2988IM-3.8/NOPB | TI | 8-SOIC | New | 详细 | |
| DAC5687MPZPEP | TI | 100-HTQFP (14x14) | New | 详细 | |
| LM3S1601-IQC50-A2T | TI | 100-LQFP (14x14) | New | 详细 | |
| SN74AC373DBR | TI | 20-SSOP | New | 详细 |
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