产品系列
产品系列
TLV3501AQDBVRQ1
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : Automotive, AEC-Q100
Part Status : Active
Type : General Purpose
Number of Elements : 1
Output Type : CMOS, Push-Pull, Rail-to-Rail, TTL
Voltage - Supply, Single/Dual (±) : 2.7V ~ 5.5V, ±1.35V ~ 2.75V
Voltage - Input Offset (Max) : 6.5mV @ 5.5V
Current - Input Bias (Max) : 10pA @ 5.5V
Current - Quiescent (Max) : 5mA
CMRR, PSRR (Typ) : 70dB CMRR, 100dB PSRR
Propagation Delay (Max) : 10ns
Hysteresis : 6mV
Operating Temperature : -40°C ~ 125°C
Package / Case : SOT-23-6
Mounting Type : Surface Mount
Supplier Device Package : SOT-23-6
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LMV822DR | TI | 8-SOIC | New | 详细 | |
| LM3S8G62-IQC80-A1 | TI | 100-LQFP (14x14) | New | 详细 | |
| SN74LV161ADBR | TI | 16-SSOP | New | 详细 | |
| SN74LVC162244ADLR | TI | 48-SSOP | New | 详细 | |
| SN74LVC74AQDRQ1 | TI | New | 详细 | ||
| TPS61256AYFFT | TI | 9-DSBGA (1.2x1.3) | New | 详细 | |
| TL432ACDBVRG4 | TI | SOT-23-5 | New | 详细 | |
| TS12A12511DRJR | TI | 8-SON (4x4) | New | 详细 | |
| LP3872ESX-3.3/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| LP3965ES-1.8/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| SN74ABT373NSR | TI | 20-SO | New | 详细 | |
| DS92LV222ATM/NOPB | TI | 16-SOIC | New | 详细 | |
| ISO7810FDW | TI | 16-SOIC | New | 详细 | |
| TPS7A6601QDGNRQ1 | TI | 8-MSOP-PowerPad | New | 详细 | |
| REF5045AIDR | TI | 8-SOIC | New | 详细 | |
| TAS3103DBTRG4 | TI | 38-TSSOP | New | 详细 | |
| TLC3545EVM | TI | New | 详细 | ||
| TRS3223IDWRG4 | TI | 20-SOIC | New | 详细 | |
| MSP430F6636IZQWR | TI | 113-BGA Microstar Junior (7x7) | New | 详细 | |
| TPS54331D | TI | 8-SOIC | New | 详细 |
请把您的采购需求告诉我们！
Copyright © 2007-2021 All Rights Reserved. - 深圳市罗斌森电子科技有限公司
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
网站设计webdesign www.wzdzkf.com