产品系列
产品系列
TLV3702ID
- Manufacturer : Texas Instruments
Packaging : Tube
Alternate Packaging
Part Status : Active
Type : General Purpose
Number of Elements : 2
Output Type : CMOS, Push-Pull, Rail-to-Rail
Voltage - Supply, Single/Dual (±) : 2.7V ~ 16V, ±1.35V ~ 8V
Voltage - Input Offset (Max) : 5mV @ 15V
Current - Input Bias (Max) : 250pA @ 15V
Current - Output (Typ) : 10mA
Current - Quiescent (Max) : 1μA
CMRR, PSRR (Typ) : 88dB CMRR, 105dB PSRR
Operating Temperature : -40°C ~ 125°C
Package / Case : 8-SOIC (0.154", 3.90mm Width)
Mounting Type : Surface Mount
Supplier Device Package : 8-SOIC
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74LVC1G80QDCKTQ1 | TI | New | 详细 | ||
| SN74AUC2GU04YEPR | TI | 6-DSBGA, 6-WCSP (1.4x0.9) | New | 详细 | |
| SN74S37DR | TI | 14-SOIC | New | 详细 | |
| BQ51013BYFPR | TI | 28-DSBGA | New | 详细 | |
| LP3891ES-1.8/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| ADS4246EVM | TI | New | 详细 | ||
| SN74LVTH240RGYR | TI | 20-VQFN (3.5x4.5) | New | 详细 | |
| ADS61B49IRGZT | TI | 48-VQFN (7x7) | New | 详细 | |
| SN74LVC3G04YEAR | TI | 8-DSBGA, 8-WCSP (1.9x0.9) | New | 详细 | |
| SN74ACT3641-20PQ | TI | 132-BQFP (24.54x24.54) | New | 详细 | |
| BQ24007PWPG4 | TI | 20-HTSSOP | New | 详细 | |
| SN75LVDS180D | TI | 14-SOIC | New | 详细 | |
| TPS62000YEGR | TI | 12-DSBGA | New | 详细 | |
| LM4040DIM3-10.0 | TI | SOT-23-3 | New | 详细 | |
| ADS127L01EVM | TI | New | 详细 | ||
| CDCF5801ADBQR | TI | 24-SSOP/QSOP | New | 详细 | |
| LM3S9DN5-IQC80-A1 | TI | 100-LQFP (14x14) | New | 详细 | |
| INA2132U/2K5 | TI | 14-SOIC | New | 详细 | |
| UC3854QTR | TI | 20-PLCC (9x9) | New | 详细 | |
| EMB1499QMHE/NOPB | TI | 28-HTSSOP | New | 详细 |
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