型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74AS258NSRE4 | TI | 16-SO | New | 详细 | |
| SN74ACT2235-40FN | TI | 44-PLCC (16.58x16.58) | New | 详细 | |
| TL3845D-8 | TI | 8-SOIC | New | 详细 | |
| DAC813JP | TI | 28-PDIP | New | 详细 | |
| OPA2316SIRUGR | TI | 10-X2QFN (2x1.5) | New | 详细 | |
| UCC28C40D | TI | 8-SOIC | New | 详细 | |
| TPS546C23EVM2-746 | TI | New | 详细 | ||
| AM1808EZWTT3 | TI | 361-NFBGA (16x16) | New | 详细 | |
| TPS72017YZUR | TI | 5-DSBGA (0.96x1.33) | New | 详细 | |
| LM6584MA | TI | 14-SOIC | New | 详细 | |
| TPS54494RSAR | TI | 16-QFN (4x4) | New | 详细 | |
| TPS70745PWPR | TI | 20-HTSSOP | New | 详细 | |
| LM2597HVN-12 | TI | 8-PDIP | New | 详细 | |
| UC3902N | TI | 8-PDIP | New | 详细 | |
| TPA3125D2EVM | TI | New | 详细 | ||
| LP3853ESX-1.8 | TI | DDPAK/TO-263-5 | New | 详细 | |
| BQ24232HEVM-608 | TI | New | 详细 | ||
| LM2588S-5.0 | TI | DDPAK/TO-263-7 | New | 详细 | |
| TLC27L2BIDR | TI | 8-SOIC | New | 详细 | |
| CD74AC245M | TI | 20-SOIC | New | 详细 |