罗斌森
  • TPS65921BZQZ

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Discontinued at Digi-Key
    Applications : Handheld/Mobile Devices, OMAP?
    Current - Supply : 300μA
    Voltage - Supply : 2.7V ~ 4.5V
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 120-VFBGA
    Supplier Device Package : 120-BGA Microstar Junior (6x6)

极速报价

型号
品牌 封装 批号 查看
LP2986IMM-5.0 TI 8-VSSOP New 详细
REF5040AIDGKT TI 8-VSSOP New 详细
OPA2364AIDR TI 8-SOIC New 详细
ADCS7476AIMF TI SOT-23-6 New 详细
PT4127A TI New 详细
SN751177NSR TI 16-SO New 详细
LMV822M/NOPB TI 8-SOIC New 详细
TMS320C5535AZHH10 TI 144-BGA MICROSTAR (12x12) New 详细
TLC5916IPW TI 16-TSSOP New 详细
LP2987AILDX-5.0/NOPB TI 8-WSON (4x4) New 详细
PCM1865EVM TI New 详细
MSP430F5308IRGCT TI 64-VQFN (9x9) New 详细
ADC14C105CISQ TI 32-WQFN (5x5) New 详细
TCA8424RHAR TI 40-VQFN (6x6) New 详细
LME49600TSBD TI New 详细
LP3873ET-5.0/NOPB TI TO-220-5 New 详细
SN74GTLPH16612DL TI 56-SSOP New 详细
CD74HC373M TI 20-SOIC New 详细
TAS5508BPAGG4 TI 64-TQFP (10x10) New 详细
TMX320F28035PAGT TI 64-TQFP (10x10) New 详细