罗斌森
  • TPS82672SIPT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MicroSip?
    Part Status : Discontinued at Digi-Key
    Type : Non-Isolated PoL Module
    Number of Outputs : 1
    Voltage - Input (Min) : 2.3V
    Voltage - Input (Max) : 4.8V
    Voltage - Output 1 : 1.5V
    Current - Output (Max) : 600mA
    Applications : ITE (Commercial)
    Features : Remote On/Off, OCP, OTP, UVLO
    Operating Temperature : -40°C ~ 85°C
    Efficiency : 90%
    Mounting Type : Surface Mount
    Package / Case : 8-BGA Module
    Size / Dimension : 0.12" L x 0.09" W x 0.04" H (3.0mm x 2.4mm x 1.0mm)
    Supplier Device Package : 8-uSIP
    Control Features : Enable, Active High

极速报价

型号
品牌 封装 批号 查看
CLC020BCQ TI 28-PLCC (11.51x11.51) New 详细
BQ2026LPR TI TO-92-3 New 详细
TPS79428DGNR TI 8-MSOP-PowerPad New 详细
LM4041CIDCKT TI SC-70-5 New 详细
LP8345CLDX-5.0/NOPB TI 6-WSON (2.92x3.29) New 详细
ADS7043IDCUR TI US8 New 详细
LM2940CS-15 TI DDPAK/TO-263-3 New 详细
UC3906DWG4 TI 16-SOIC New 详细
SN55HVD75DRBREP TI 8-SON (3x3) New 详细
TLC5951DAP TI 38-HTSSOP New 详细
SN74LVU04AD TI 14-SOIC New 详细
TPS54294PWPR TI 16-HTSSOP New 详细
TSB41LV03APFP TI 80-HTQFP (12x12) New 详细
DM385AAARD21F TI 609-FCBGA (16x16) New 详细
SN74LVC04AQPWRQ1 TI 14-TSSOP New 详细
TLC27L2CDR TI 8-SOIC New 详细
LM193DR TI 8-SOIC New 详细
RC4558PG4 TI 8-PDIP New 详细
CD74HC138M TI 16-SOIC New 详细
TPS82671EVM-646 TI New 详细