罗斌森
  • TPS82676SIPR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MicroSip?
    Part Status : Active
    Type : Non-Isolated PoL Module
    Number of Outputs : 1
    Voltage - Input (Min) : 2.3V
    Voltage - Input (Max) : 4.8V
    Voltage - Output 1 : 1.1V
    Current - Output (Max) : 600mA
    Applications : ITE (Commercial)
    Features : Remote On/Off, OCP, OTP, UVLO
    Operating Temperature : -40°C ~ 85°C
    Efficiency : 90%
    Mounting Type : Surface Mount
    Package / Case : 8-BGA Module
    Size / Dimension : 0.12" L x 0.09" W x 0.04" H (3.0mm x 2.4mm x 1.0mm)
    Supplier Device Package : 8-uSIP
    Control Features : Enable, Active High

极速报价

型号
品牌 封装 批号 查看
TPS2530DBVR TI SOT-23-5 New 详细
SN65HVD52DR TI 8-SOIC New 详细
OPA2344PAG4 TI 8-PDIP New 详细
LM2575SX-3.3 TI DDPAK/TO-263-5 New 详细
CD74HC283E TI 16-PDIP New 详细
TPS3851H25EQDRBRQ1 TI 8-SON (3x3) New 详细
CD74HCT02M TI 14-SOIC New 详细
UCC2801D TI 8-SOIC New 详细
THS4271DGKRG4 TI 8-VSSOP New 详细
LMS8117AMPX-1.8/NOPB TI SOT-223-3 New 详细
LMH0307GR/NOPB TI 25-CSBGA (3x3) New 详细
TL431BIPKG3 TI SOT-89-3 New 详细
EKC-LM3S8962 TI New 详细
LM2676T-ADJ/NOPB TI TO-220-7 New 详细
LP2989AIM-3.0 TI 8-SOIC New 详细
MSP430F5504IPTR TI 48-LQFP (7x7) New 详细
DS1487MX/NOPB TI 8-SOIC New 详细
UCC2800DTR TI 8-SOIC New 详细
SN74LS594NSRG4 TI 16-SO New 详细
SN74HC273QDWRG4Q1 TI New 详细