罗斌森
  • TPS82676SIPR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MicroSip?
    Part Status : Active
    Type : Non-Isolated PoL Module
    Number of Outputs : 1
    Voltage - Input (Min) : 2.3V
    Voltage - Input (Max) : 4.8V
    Voltage - Output 1 : 1.1V
    Current - Output (Max) : 600mA
    Applications : ITE (Commercial)
    Features : Remote On/Off, OCP, OTP, UVLO
    Operating Temperature : -40°C ~ 85°C
    Efficiency : 90%
    Mounting Type : Surface Mount
    Package / Case : 8-BGA Module
    Size / Dimension : 0.12" L x 0.09" W x 0.04" H (3.0mm x 2.4mm x 1.0mm)
    Supplier Device Package : 8-uSIP
    Control Features : Enable, Active High

极速报价

型号
品牌 封装 批号 查看
TLV62568DBVT TI SOT-23-5 New 详细
BQ27210DRKRG4 TI 10-VSON (3x4) New 详细
SN74LVC1G3157YZPR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细
SN74ALVC08DR TI 14-SOIC New 详细
UA78M08CKC TI TO-220-3 New 详细
TLV2474IDR TI 14-SOIC New 详细
SN74LVTH16646DGGR TI 56-TSSOP New 详细
LM95235QEIMM TI 8-VSSOP New 详细
UCC27525DGNR TI 8-MSOP-PowerPad New 详细
ISOW7840DWE TI 16-SOIC New 详细
AM4378BZDNA80 TI 491-NFBGA (17x17) New 详细
TLV431AQDBVRQ1 TI SOT-23-5 New 详细
LM3S1P51-IBZ80-C5 TI 108-BGA (10x10) New 详细
LM61BIM3X/NOPB TI SOT-23-3 New 详细
CD74HCT164M TI 14-SOIC New 详细
LM335AZ/NOPB TI TO-92-3 New 详细
SN74LVC1G04YEPR TI 5-DSBGA, 5-WCSP (1.4x0.9) New 详细
TLC279CN TI 14-PDIP New 详细
TPS3619-33DGK TI 8-VSSOP New 详细
TLV75729PDBVR TI SOT-23-5 New 详细