产品系列
- 首页 / 穿孔工具，刀片，配件
产品系列
TPS82693SIPR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MicroSip?
Part Status : Active
Type : Non-Isolated PoL Module
Number of Outputs : 1
Voltage - Input (Min) : 2.3V
Voltage - Input (Max) : 4.8V
Voltage - Output 1 : 2.85V
Current - Output (Max) : 800mA
Applications : ITE (Commercial)
Features : OCP, OTP, UVLO
Operating Temperature : -40°C ~ 85°C
Efficiency : 95%
Mounting Type : Surface Mount
Package / Case : 8-BGA Module
Size / Dimension : 0.11" L x 0.09" W x 0.04" H (2.9mm x 2.3mm x 1.0mm)
Supplier Device Package : 8-uSIP
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| CDCVF857RHAR | TI | 40-VQFN (6x6) | New | 详细 | |
| SN74CBT3383CDBRG4 | TI | 24-SSOP | New | 详细 | |
| TPS2096D | TI | 16-SOIC | New | 详细 | |
| TLV369IDCKR | TI | SC-70-5 | New | 详细 | |
| TPS62044DGQ | TI | 10-MSOP-PowerPad | New | 详细 | |
| SN74F257NSR | TI | 16-SO | New | 详细 | |
| DAC8760IRHAT | TI | 40-VQFN (6x6) | New | 详细 | |
| UCC2809P-1 | TI | 8-VSSOP | New | 详细 | |
| GC5016-PBZ | TI | 252-BGA (17x17) | New | 详细 | |
| LP3883ESX-1.2 | TI | DDPAK/TO-263-5 | New | 详细 | |
| MSP-EXP430FR5994 | TI | New | 详细 | ||
| TAS5411Q1EVM | TI | New | 详细 | ||
| ADS42JB49EVM | TI | New | 详细 | ||
| TLC372MDR | TI | 8-SOIC | New | 详细 | |
| LM4132CQ1MFT3.3 | TI | SOT-23-5 | New | 详细 | |
| TLC274IN | TI | 14-PDIP | New | 详细 | |
| CDCLVD2108RGZT | TI | 48-VQFN (7x7) | New | 详细 | |
| LMH6321TS | TI | DDPAK/TO-263-7 | New | 详细 | |
| ISO7140FCCDBQ | TI | 16-SSOP | New | 详细 | |
| THS6093IDRG4 | TI | 14-SOIC | New | 详细 |
请把您的采购需求告诉我们！
Copyright © 2007-2021 All Rights Reserved. - 深圳市罗斌森电子科技有限公司
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
网站设计webdesign www.wzdzkf.com