罗斌森
  • TPS82693SIPR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MicroSip?
    Part Status : Active
    Type : Non-Isolated PoL Module
    Number of Outputs : 1
    Voltage - Input (Min) : 2.3V
    Voltage - Input (Max) : 4.8V
    Voltage - Output 1 : 2.85V
    Current - Output (Max) : 800mA
    Applications : ITE (Commercial)
    Features : OCP, OTP, UVLO
    Operating Temperature : -40°C ~ 85°C
    Efficiency : 95%
    Mounting Type : Surface Mount
    Package / Case : 8-BGA Module
    Size / Dimension : 0.11" L x 0.09" W x 0.04" H (2.9mm x 2.3mm x 1.0mm)
    Supplier Device Package : 8-uSIP

极速报价

型号
品牌 封装 批号 查看
TS5V522CDBQR TI 24-SSOP/QSOP New 详细
LP2989IMX-3.3/NOPB TI 8-SOIC New 详细
SN75HVD11DR TI 8-SOIC New 详细
XTR112U TI 14-SO New 详细
CD74HCT374E TI New 详细
LM3203TLX/NOPB TI 10-TμSMD (1.82x2.17) New 详细
TRS208CDWG4 TI 24-SOIC New 详细
LM2941T/LF08 TI TO-220-5 New 详细
TPS7A3501EVM-547 TI New 详细
TPS72748YFFR TI 4-DSBGA New 详细
TPS2231MRGPT-3 TI 20-QFN (4x4) New 详细
TPS2069DGNR TI 8-MSOP-PowerPad New 详细
LP3995ILDX-1.6 TI 6-WSON (2.92x3.29) New 详细
TLC25M4CD TI 14-SOIC New 详细
DAC900TPWRQ1 TI 28-TSSOP New 详细
LMV2011MF TI SOT-23-5 New 详细
TRS3238IPW TI 28-TSSOP New 详细
ADS6442IRGCT TI 64-VQFN (9x9) New 详细
OPA2835IDGSEVM TI New 详细
SM72295EVM TI New 详细