罗斌森
  • TPS82693SIPR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MicroSip?
    Part Status : Active
    Type : Non-Isolated PoL Module
    Number of Outputs : 1
    Voltage - Input (Min) : 2.3V
    Voltage - Input (Max) : 4.8V
    Voltage - Output 1 : 2.85V
    Current - Output (Max) : 800mA
    Applications : ITE (Commercial)
    Features : OCP, OTP, UVLO
    Operating Temperature : -40°C ~ 85°C
    Efficiency : 95%
    Mounting Type : Surface Mount
    Package / Case : 8-BGA Module
    Size / Dimension : 0.11" L x 0.09" W x 0.04" H (2.9mm x 2.3mm x 1.0mm)
    Supplier Device Package : 8-uSIP

极速报价

型号
品牌 封装 批号 查看
SN74LVC1G07YZPR TI 5-DSBGA, 5-WCSP (1.4x0.9) New 详细
74ACT11244DWR TI 24-SOIC New 详细
LP2982IM5X-5.0 TI SOT-23-5 New 详细
LM3S9L97-IBZ80-C5 TI 108-BGA (10x10) New 详细
LM4128DMF-2.5 TI SOT-23-5 New 详细
LM324ADRG4 TI 14-SOIC New 详细
LP8900TLX-AAEC/NOPB TI 6-DSBGA (1.5x1.3) New 详细
MSC1214Y3PAGRG4 TI 64-TQFP (10x10) New 详细
LM318M TI 8-SOIC New 详细
MC3403D TI 14-SOIC New 详细
PCM1702U-J TI 20-SO New 详细
UCC28500DWTRG4 TI 20-SOIC New 详细
SN751730N TI 16-PDIP New 详细
TPS3852G33DRBR TI 8-SON (3x3) New 详细
SN74LS90DR TI 14-SOIC New 详细
LM3S1D21-IBZ80-A1 TI 108-BGA (10x10) New 详细
TPS71718DSER TI 6-WSON (1.5x1.5) New 详细
TPS2061CDGNR TI 8-MSOP-PowerPad New 详细
TLVH431QDBZT TI SOT-23-3 New 详细
SN74LVC1G80YZAR TI New 详细