罗斌森
  • TS3DDR3812RUAR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Applications : Memory
    Multiplexer/Demultiplexer Circuit : 2:1
    Number of Channels : 12
    On-State Resistance (Max) : 12 Ohm
    Voltage - Supply, Single (V+) : 3V ~ 3.6V
    -3db Bandwidth : 1.675GHz
    Features : DDR3
    Operating Temperature : -40°C ~ 85°C (TA)
    Package / Case : 42-WFQFN Exposed Pad
    Supplier Device Package : 42-WQFN (3.5x9.0)

极速报价

型号
品牌 封装 批号 查看
TMX320C6670CYP TI 841-FCBGA (24x24) New 详细
74FCT162501ATPACT TI 56-TSSOP New 详细
TPS75501KTTRG3 TI DDPAK/TO-263-5 New 详细
OPA37GP TI 8-PDIP New 详细
TPS2067DR TI 16-SOIC New 详细
TCAN1042HGVDRQ1 TI 8-SOIC New 详细
LP5521YQX/NOPB TI 24-WQFN (4x5) New 详细
LMH6704MA TI 8-SOIC New 详细
LP3874ESX-2.5 TI DDPAK/TO-263-5 New 详细
LM5088MH-1EVAL TI New 详细
THS4601CDDAR TI 8-SO PowerPad New 详细
THS4081IDGNR TI 8-MSOP-PowerPad New 详细
LM2931CT/LF03 TI TO-220-3 New 详细
LM12H458CIVX/NOPB TI 44-PLCC (16.58x16.58) New 详细
SN10502DGN TI 8-MSOP-PowerPad New 详细
LM3723EM5-2.32/NOPB TI SOT-23-5 New 详细
74FCT162501ATPVCG4 TI 56-SSOP New 详细
TAS5424ATDKDMQ1 TI 44-HSSOP New 详细
SN74LVC1G332DBVR TI SOT-23-6 New 详细
ADS8383IBPFBR TI 48-TQFP (7x7) New 详细