产品系列
产品系列
TS3DDR3812RUAR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Part Status : Active
Applications : Memory
Multiplexer/Demultiplexer Circuit : 2:1
Number of Channels : 12
On-State Resistance (Max) : 12 Ohm
Voltage - Supply, Single (V+) : 3V ~ 3.6V
-3db Bandwidth : 1.675GHz
Features : DDR3
Operating Temperature : -40°C ~ 85°C (TA)
Package / Case : 42-WFQFN Exposed Pad
Supplier Device Package : 42-WQFN (3.5x9.0)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TRS3222IDW | TI | 20-SOIC | New | 详细 | |
| LM9076QBMAX-3.3/NOPB | TI | 8-SOIC | New | 详细 | |
| OPA2170AIDGK | TI | 8-VSSOP | New | 详细 | |
| TLV70450DBVT | TI | SOT-23-5 | New | 详细 | |
| TMS320C6657CZH25 | TI | 625-FCBGA (21x21) | New | 详细 | |
| DS25BR400TSQ | TI | 60-WQFN (9x9) | New | 详细 | |
| SN74ABT18502PM | TI | 64-LQFP (10x10) | New | 详细 | |
| TPA6120A2RGYEVM | TI | New | 详细 | ||
| TRF7960ARHBT | TI | 32-VQFN (5x5) | New | 详细 | |
| SN74AUP1G00DCKR | TI | SC-70-5 | New | 详细 | |
| LM9076S-3.3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| TLV5604IDRG4 | TI | 16-SOIC | New | 详细 | |
| LMX2315TMX | TI | 20-TSSOP | New | 详细 | |
| LM385BM-1.2/NOPB | TI | 8-SOIC | New | 详细 | |
| SN75176BPE4 | TI | 8-PDIP | New | 详细 | |
| TL16C2550RHB | TI | 32-VQFN (5x5) | New | 详细 | |
| TPS5405EVM | TI | New | 详细 | ||
| LM3402HVMM/NOPB | TI | 8-VSSOP | New | 详细 | |
| LM6154BCMX | TI | 14-SOIC | New | 详细 | |
| LM4843MHX | TI | 20-HTSSOP | New | 详细 |
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