产品系列
TXS0206-29YFPR
- Manufacturer : Texas Instruments
Packaging : Tape & Reel (TR)
Alternate Packaging
Part Status : Obsolete
Translator Type : Voltage Level
Channel Type : Bidirectional
Number of Circuits : 1
Channels per Circuit : 4
Voltage - VCCA : 1.1V ~ 3.6V
Voltage - VCCB : 1.1V ~ 3.6V
Output Type : Open Drain
Data Rate : 60Mbps
Operating Temperature : -40°C ~ 85°C (TA)
Features : SIM Card Interface
Mounting Type : Surface Mount
Package / Case : 20-XFBGA, DSBGA
Supplier Device Package : 20-DSBGA
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TMS320VC549ZGU-100 | TI | 144-BGA MICROSTAR (12x12) | New | 详细 | |
| THS4221D | TI | 8-SOIC | New | 详细 | |
| LM140LAH-15 | TI | TO-39-3 | New | 详细 | |
| DAC7612U | TI | 8-SOIC | New | 详细 | |
| SN74AUP1G08YEPR | TI | 5-DSBGA, 5-WCSP (1.4x0.9) | New | 详细 | |
| UCC3957M-1 | TI | 16-SSOP | New | 详细 | |
| CD74HC4316NSR | TI | 16-SO | New | 详细 | |
| LM360M/NOPB | TI | 8-SOIC | New | 详细 | |
| BQ40Z50RSMR-R1 | TI | 32-VQFN (4x4) | New | 详细 | |
| LP2982AIBPX-3.0 | TI | 5-μSMD (0.93x1.11) | New | 详细 | |
| LP3874ES-3.3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| TPS610996YFFR | TI | 6-DSBGA | New | 详细 | |
| LMH6321MR/NOPB | TI | 8-SO PowerPad | New | 详细 | |
| REG101UA-2.8 | TI | 8-SOIC | New | 详细 | |
| THS4501CDGKG4 | TI | 8-VSSOP | New | 详细 | |
| TMX5700914PGEQQ1 | TI | 144-QFP (20x20) | New | 详细 | |
| SN74V3640-10PEU | TI | 128-LQFP (14x20) | New | 详细 | |
| TPS2022DR | TI | 8-SOIC | New | 详细 | |
| TXS0104EDR | TI | 14-SOIC | New | 详细 | |
| OMAPL137DZKBT3 | TI | 256-BGA (17x17) | New | 详细 |
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