罗斌森
  • TWL6030B107CMR

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Part Status : Active
    Applications : Handheld/Mobile Devices, OMAP?
    Current - Supply : 20μA
    Voltage - Supply : 2.5V ~ 4.8V
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 187-VFBGA, FCBGA
    Supplier Device Package : 187-FCBGA (7x7)

极速报价

型号
品牌 封装 批号 查看
SN74ALVCH16501KR TI 56-BGA MICROSTAR JUNIOR (7.0x4.5) New 详细
TPS3852G33QDRBRQ1 TI 8-SON (3x3) New 详细
SN65LVDS93ADGGR TI 56-TSSOP New 详细
TPA0222PWPRG4 TI 24-HTSSOP New 详细
CD40147BPWG4 TI 16-TSSOP New 详细
LM2574HVN-12/NOPB TI 8-PDIP New 详细
LMF100CIWM/NOPB TI 20-SOIC New 详细
ADS5485IRGC25 TI 64-VQFN (9x9) New 详细
BQ25703ARSNT TI 32-QFN (4x4) New 详细
LM4853LD/NOPB TI 14-WSON (4x4) New 详细
SN65HVD1780DRG4 TI 8-SOIC New 详细
LM5064EVK/NOPB TI New 详细
MAX3232EIPWR TI 16-TSSOP New 详细
LP3470IM5X-2.93 TI SOT-23-5 New 详细
DAC7545LU TI 20-SOIC New 详细
DAC7614E/1K TI 20-SSOP New 详细
SCAN921025HSM/NOPB TI 49-BGA (7x7) New 详细
TLV2432IDR TI 8-SOIC New 详细
LM2675M-ADJ TI 8-SOIC New 详细
TL4051C12IDBZR TI SOT-23-3 New 详细