罗斌森
  • TWL6030B107CMR

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Part Status : Active
    Applications : Handheld/Mobile Devices, OMAP?
    Current - Supply : 20μA
    Voltage - Supply : 2.5V ~ 4.8V
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 187-VFBGA, FCBGA
    Supplier Device Package : 187-FCBGA (7x7)

极速报价

型号
品牌 封装 批号 查看
TPS76750QPWP TI 20-HTSSOP New 详细
TLV3542IDR TI 8-SOIC New 详细
TM4C1233H6PGEIR TI 144-LQFP (20x20) New 详细
TMS320DM6441ZWT TI 361-NFBGA (16x16) New 详细
LM5100MX TI 8-SOIC New 详细
TLE2021CDR TI 8-SOIC New 详细
PCI2050BPPM TI 208-QFP (28x28) New 详细
LM337KVURG3 TI TO-252-3 New 详细
LMV7219M5X/NOPB TI SOT-23-5 New 详细
RI-ANT-G01E-30 TI New 详细
SN74ALS574BN TI New 详细
SN74LS153NSR TI 16-SO New 详细
LP5907SNX-1.2/NOPB TI 4-X2SON (1x1) New 详细
SN74HC02N TI 14-PDIP New 详细
TPS2066CDGNEVM-015 TI New 详细
SN74CBT3384CDBQR TI 24-SSOP/QSOP New 详细
THS4022IDRG4 TI 8-SOIC New 详细
CY74FCT16245ATPVC TI 48-SSOP New 详细
THS3096PWPRG4 TI 14-HTSSOP New 详细
TL7757ILP TI TO-92-3 New 详细