罗斌森
  • TWL6030B107CMR

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Part Status : Active
    Applications : Handheld/Mobile Devices, OMAP?
    Current - Supply : 20μA
    Voltage - Supply : 2.5V ~ 4.8V
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 187-VFBGA, FCBGA
    Supplier Device Package : 187-FCBGA (7x7)

极速报价

型号
品牌 封装 批号 查看
MSP430F2122TRHBR TI 32-VQFN (5x5) New 详细
LM3S5956-IQR80-C3T TI 64-LQFP (10x10) New 详细
MSP430F235TPM TI 64-LQFP (10x10) New 详细
LM2931AM-5.0/NOPB TI 8-SOIC New 详细
LM3S2410-IQC25-A2 TI 100-LQFP (14x14) New 详细
TPS26620DRCT TI 10-VSON (3x3) New 详细
LM2676SDX-ADJ TI 14-VSON (5x6) New 详细
TLC5620IN TI 14-PDIP New 详细
LP5907UVX-3.0/NOPB TI 4-DSBGA New 详细
TAS5182DCA TI 56-HTSSOP New 详细
PTH04T241WAZ TI New 详细
CLVC2G125IDCTRQ1 TI SM8 (SSOP) New 详细
RM48L952PGET TI 144-LQFP (20x20) New 详细
LM3S1P51-IQC80-C3 TI 100-LQFP (14x14) New 详细
SN74LV27ANSR TI 14-SOP New 详细
DAC7631EVM TI New 详细
DM388AAARD11 TI 609-FCBGA (16x16) New 详细
SN74SSTV16859DGGR TI 64-TSSOP New 详细
DP83848YB-EVK/NOPB TI New 详细
ADC12DL066CIVS/NOPB TI 64-TQFP (10x10) New 详细