产品系列
产品系列
TWL6030B1A4CMR
- Manufacturer : Texas Instruments
Packaging : Bulk
Alternate Packaging
Part Status : Active
Applications : Handheld/Mobile Devices, OMAP?
Current - Supply : 20μA
Voltage - Supply : 2.5V ~ 4.8V
Operating Temperature : -40°C ~ 85°C
Mounting Type : Surface Mount
Package / Case : 187-VFBGA, FCBGA
Supplier Device Package : 187-FCBGA (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TPS61310EVM-638 | TI | New | 详细 | ||
| LM4890ITP/NOPB | TI | 8-μSMD (1.36x1.36) | New | 详细 | |
| LM25011AQ1MY/NOPB | TI | 10-MSOP-PowerPad | New | 详细 | |
| TPS73201DCQG4 | TI | SOT-223-6 | New | 详细 | |
| SN74AUC1G126YZPR | TI | 5-DSBGA, 5-WCSP (1.4x0.9) | New | 详细 | |
| TPS62150ARGTT | TI | 16-QFN (3x3) | New | 详细 | |
| LP3852EMPX-3.3/NOPB | TI | SOT-223-5 | New | 详细 | |
| TVP5146M1PFPG4 | TI | 80-HTQFP (12x12) | New | 详细 | |
| LP2985-28DBVT | TI | SOT-23-5 | New | 详细 | |
| LM1973MX/NOPB | TI | 20-SOIC | New | 详细 | |
| TMS320VC5407GGU | TI | 144-BGA MICROSTAR (12x12) | New | 详细 | |
| LM3S617-EGZ50-C2 | TI | 48-VQFN (7x7) | New | 详细 | |
| CD74HC21M96 | TI | 14-SOIC | New | 详细 | |
| LMH6552SDX/NOPB | TI | 8-WSON (3x2.5) | New | 详细 | |
| SN74HC00PW | TI | 14-TSSOP | New | 详细 | |
| CDCVF2310PWG4 | TI | 24-TSSOP | New | 详细 | |
| LMC7221BIM | TI | 8-SOIC | New | 详细 | |
| UC2526ADWTR | TI | 18-SOIC | New | 详细 | |
| OPA37GP | TI | 8-PDIP | New | 详细 | |
| DRV3220QPHPRQ1 | TI | 48-HTQFP (7x7) | New | 详细 |
请把您的采购需求告诉我们！
Copyright © 2007-2021 All Rights Reserved. - 深圳市罗斌森电子科技有限公司
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
网站设计webdesign www.wzdzkf.com