产品系列
产品系列
TXS02326AMRGER
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Part Status : Active
Applications : Mobile Handsets
Interface : I2C
Voltage - Supply : 1.7V ~ 3.3V
Package / Case : 24-VFQFN Exposed Pad
Supplier Device Package : 24-VQFN (4x4)
Mounting Type : Surface Mount
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| CD74AC10M | TI | 14-SOIC | New | 详细 | |
| SN74LVC14ADR | TI | 14-SOIC | New | 详细 | |
| INA2181A3QDGSRQ1 | TI | 10-VSSOP | New | 详细 | |
| SN74LV175APW | TI | New | 详细 | ||
| DRV8801EVM | TI | New | 详细 | ||
| DRV8833CRTER | TI | 16-WQFN (3x3) | New | 详细 | |
| TL594IPW | TI | 16-TSSOP | New | 详细 | |
| SN65DP159RGZR | TI | 48-VQFN (7x7) | New | 详细 | |
| TLV71728PDQNR3 | TI | 4-X2SON (1x1) | New | 详细 | |
| LM3S1110-IBZ25-A2T | TI | 108-BGA (10x10) | New | 详细 | |
| LM1972N | TI | 20-DIP | New | 详细 | |
| OPA2613IDTJRG3 | TI | 8-HSOP | New | 详细 | |
| PCF8574APW | TI | 20-TSSOP | New | 详细 | |
| LP3963ES-3.3/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| LMH6619MA/NOPB | TI | 8-SOIC | New | 详细 | |
| SN74LVC861APWT | TI | 24-TSSOP | New | 详细 | |
| CD74HC373M | TI | 20-SOIC | New | 详细 | |
| CC1151IRHBRG4Q1 | TI | New | 详细 | ||
| LMC6482AIMX | TI | 8-SOIC | New | 详细 | |
| LM3445-208277EV/NOPB | TI | New | 详细 |
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