产品系列
UCC5310MCDWV
- Manufacturer : Texas Instruments
Part Status : Active
Technology : Capacitive Coupling
Number of Channels : 1
Voltage - Isolation : 3000Vrms
Common Mode Transient Immunity (Min) : 100kV/μs
Propagation Delay tpLH / tpHL (Max) : 75ns, 75ns
Pulse Width Distortion (Max) : 20ns
Rise / Fall Time (Typ) : 12ns, 10ns
Current - Output High, Low : 2.4A, 1.1A
Current - Peak Output : 4.3A
Voltage - Output Supply : 13.2V ~ 33V
Operating Temperature : -40°C ~ 125°C
Mounting Type : Surface Mount
Package / Case : 8-SOIC (0.295", 7.50mm Width)
Supplier Device Package : 8-SOIC
Approvals : CQC, UR, VDE
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74ALVC125D | TI | 14-SOIC | New | 详细 | |
| LM26484SQE/NOPB | TI | 24-WQFN (4x5) | New | 详细 | |
| DAC811BH | TI | 28-CDIP | New | 详细 | |
| TS5A3159DCKT | TI | SC-70-6 | New | 详细 | |
| TMS320VC5402GGU100 | TI | 144-BGA MICROSTAR (12x12) | New | 详细 | |
| TPS55340EVM-147 | TI | New | 详细 | ||
| TPS73512QDRBRQ1 | TI | 8-SON (3x3) | New | 详细 | |
| CSD18563Q5A | TI | 8-VSONP (5x6) | New | 详细 | |
| LM2577S-15/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| THS7002CPWP | TI | 28-HTSSOP | New | 详细 | |
| LM2673SX-5.0 | TI | DDPAK/TO-263-7 | New | 详细 | |
| TPS65632RTET | TI | 16-WQFN (3x3) | New | 详细 | |
| SN75ALS173N | TI | 16-PDIP | New | 详细 | |
| TLC2274MDRG4 | TI | 14-SOIC | New | 详细 | |
| LP38691SDX-1.8 | TI | 6-WSON (3x3) | New | 详细 | |
| LM35AH | TI | TO-46-3 | New | 详细 | |
| BQ24316DSGR | TI | 8-WSON (2x2) | New | 详细 | |
| LMH6626MMX | TI | 8-VSSOP | New | 详细 | |
| SN74BCT241DWRG4 | TI | 20-SOIC | New | 详细 | |
| UCC2800QDREP | TI | 8-SOIC | New | 详细 |
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