产品系列
UCC5390SCD
- Manufacturer : Texas Instruments
Packaging : Tube
Alternate Packaging
Part Status : Active
Technology : Capacitive Coupling
Number of Channels : 1
Voltage - Isolation : 3000Vrms
Common Mode Transient Immunity (Min) : 100kV/μs
Propagation Delay tpLH / tpHL (Max) : 100ns, 100ns
Pulse Width Distortion (Max) : 20ns
Rise / Fall Time (Typ) : 10ns, 10ns
Current - Output High, Low : 10A, 10A
Voltage - Output Supply : 13.2V ~ 33V
Operating Temperature : -40°C ~ 125°C
Mounting Type : Surface Mount
Package / Case : 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package : 8-SOIC
Approvals : CQC, CSA, UR, VDE
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| INA193AIDBVR | TI | SOT-23-5 | New | 详细 | |
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| ADS1258IPHPREP | TI | 48-HTQFP (7x7) | New | 详细 | |
| SD1983EVK/NOPB | TI | New | 详细 | ||
| SN74AC244DWR | TI | 20-SOIC | New | 详细 | |
| LMS1587CSX-ADJ/NOPB | TI | DDPAK/TO-263-3 | New | 详细 | |
| CC2591RGVTG4 | TI | 16-VQFN (4x4) | New | 详细 | |
| CD4066BMT | TI | New | 详细 | ||
| LMV822MMX | TI | 8-VSSOP | New | 详细 | |
| SN74AUC2G02YEPR | TI | 8-DSBGA, 8-WCSP (1.9x0.9) | New | 详细 | |
| AM5716AABCD | TI | 760-FCBGA (23x23) | New | 详细 | |
| MAX3222IDWR | TI | 20-SOIC | New | 详细 | |
| LP5907SNX-1.2/NOPB | TI | 4-X2SON (1x1) | New | 详细 | |
| ADS8380IRHPR | TI | 28-VQFN-EP (6x6) | New | 详细 | |
| LMV358IDR | TI | 8-SOIC | New | 详细 | |
| TPS79333DBVR | TI | SOT-23-5 | New | 详细 | |
| SN74GTLP1394PWR | TI | 16-TSSOP | New | 详细 | |
| SN65HVD230QDRQ1 | TI | 8-SOIC | New | 详细 | |
| SN74LVU04APWR | TI | 14-TSSOP | New | 详细 |
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