产品系列

罗斌森
  • VSP3100YG4

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Part Status : Not For New Designs
    Type : CCD Signal Processor, 14-Bit
    Mounting Type : Surface Mount
    Package / Case : 48-LQFP
    Supplier Device Package : 48-LQFP (7x7)

极速报价

型号
品牌 封装 批号 查看
TPS65721RSNR TI 32-QFN (4x4) New 详细
TMS320C6202GLS250 TI 384-FCBGA (18x18) New 详细
UCC383TDKTTT-3 TI DDPAK/TO-263-3 New 详细
LM3S1439-IBZ50-A2T TI 108-BGA (10x10) New 详细
SN74LVC2G86YEPR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 详细
DAPSIGCNDBRDUNPEVM TI New 详细
DRV8804PWPR TI 16-HTSSOP New 详细
SN74ABT16373ADL TI 48-SSOP New 详细
ADS7866IDBVR TI SOT-23-6 New 详细
SN74ACT3632-15PQG4 TI 132-BQFP (24.54x24.54) New 详细
SN74AUC2G08YEPR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 详细
SN74HC244MDWREP TI 20-SOIC New 详细
TPS2231MRGPT TI 20-QFN (4x4) New 详细
TPS7A4701RGWR TI 20-VQFN (5x5) New 详细
TLC27L4BCD TI 14-SOIC New 详细
SN74LV573ATPWR TI 20-TSSOP New 详细
LM2904QPWRQ1 TI 8-TSSOP New 详细
TL972IDGKR TI 8-VSSOP New 详细
SN74HC368DBR TI 16-SSOP New 详细
SN74HC74D TI New 详细